A removable interface adapter includes a frame, a first set of contacts configured for connection to a first set of test head contacts in a test system, and a second set of contacts configured for connection to a test board having at least one device to be tested. The first and second adapter contacts are interconnected so that electronic devices placed in the test board can be tested by the test system. With this adapter, test boards made for one test system can be used on other test systems.
David Anderson - Gurnee IL, US Jack Weimer - Grayslake IL, US
Assignee:
Eagle Test Systems, Inc. - Buffalo Grove IL
International Classification:
H03M 1/10
US Classification:
341120, 341155
Abstract:
Methods and apparatus, including computer program products, to test analog to digital converters, are disclosed. In general, data is received that characterizes a first digital code from a device under test at a first analog voltage of an analog signal generator and a second digital code being a digital code threshold, and a step size is generated for another test of the device by performing a calculation by a processor. The calculation may include multiplying a least significant bit size of the device with a difference of the first and second digital codes to generate a product, and dividing the product by a least significant bit size of the analog signal generator. The first digital code may be calculated from results from multiple subtests in the test, where each of the subtests includes multiple analog to digital conversions by the device at the first analog voltage.
Methods And Apparatus For Testing Electronic Devices
Gordon Samuelson - Lake Villa IL, US Jack Weimer - Grayslake IL, US
Assignee:
EAGLE TEST SYSTEMS, INC.
International Classification:
G06F019/00 G01R027/28 G01R031/00 G01R031/14
US Classification:
702/117000
Abstract:
Apparatus for testing an electronic device under a plurality of test conditions created during a test sequence includes an arbitrary waveform generator that sequentially generates the plurality of test conditions. The test conditions include selectively forcing voltage or forcing current over a wide range of amplitudes, measuring a plurality of results with various resolutions and at selected times during the test sequence, changing filter settings, gains and other parameters. The test conditions are selected and set under the control of a system clock using data stored in memory. A controller initiates the test sequence of the apparatus and determines whether measured results are within predetermined specifications. The controller uses processor-driven software, but the settings of the test apparatus are changed at predetermined times during the test sequence, without controller intervention. Several test apparatus are typically managed by one controller. Performing test sequences without controller intervention reduces the time required for testing.
Automated Test Equipment For Testing High-Power Electronic Components
Aspects of the present application are directed to an automated test equipment (ATE) and methods for operating the same for testing high-power electronic components. The inventor has recognized and appreciated an ATE that provides both high-power alternating-current (AC) and direct-current (DC) testing in a single test system can lead to high throughput testing for high-power components with reduced system hardware complexity and cost. Aspects of the present application provide a synchronized inductor switch module and both a high-precision digitizer and a high-speed digitizer for capturing DC and AC characteristics of a high-power transistor.
Current Regulation For Accurate And Low-Cost Voltage Measurements At The Wafer Level
- North Reading MA, US Jack E. Weimer - Gurnee IL, US
Assignee:
Teradyne, Inc. - North Reading MA
International Classification:
G01R 1/04 G01R 1/073 G01R 31/26
Abstract:
A test system and test techniques for accurate high current parametric testing of semiconductor devices. In operation, the test system supplies a current to the semiconductor device and measures a voltage on the device. The testing system may use the measured voltage to compute an ON resistance for the high-current semiconductor device. In one technique, multiple force needles contact a pad in positions that provide equi-resistant paths to one or more sense needles contacting the same pad. In another technique, current flow through the force needles is regulated such that voltage at the pad of the device under test is representative of the ON resistance of the device and independent of contact resistance of the force needle. Another technique entails generating an alarm indication when the contact resistance of a force needle exceeds a threshold.
Equi-Resistant Probe Distribution For High-Accuracy Voltage Measurements At The Wafer Level
- North Reading MA, US Jack E. Weimer - Gurnee IL, US
Assignee:
Teradyne, Inc. - North Reading MA
International Classification:
G01R 1/04 G01R 1/073 G01R 31/26
Abstract:
A test system and test techniques for accurate high-current parametric testing of semiconductor devices. In operation, the test system supplies a current to the semiconductor device and measures a voltage on the device. The testing system may use the measured voltage to compute an ON resistance for the high-current semiconductor device. In one technique, multiple force needles contact a pad in positions that provide equi-resistant paths to one or more sense needles contacting the same pad. In another technique, current flow through the force needles is regulated such that voltage at the pad of the device under test is representative of the ON resistance of the device and independent of contact resistance of the force needle. Another technique entails generating an alarm indication when the contact resistance of a force needle exceeds a threshold.
Jack Weimer Massage Therapy - Description: Deep Tissue Massage, Reflexology, Myofascial Release - General Information: I have been a nationally certified ...