Jacob J Yoder

US Patent:

20200236797, Jul 23, 2020

Filed:

Jan 22, 2019

Appl. No.:

16/253729

Inventors:

- Southfield MI, US
Jacob Jay Yoder - Dundee MI, US
Luis Fernando Sanchez - Commerce Twp. MI, US
Floyd J. Malecke - South Lyon MI, US

International Classification:

H05K 5/00
H05K 5/06

Abstract:

An apparatus includes a housing, a circuit board, a sealant and a baseplate. The housing may have a shelf and a flange along an open side. The circuit board may be (i) disposed on the shelf of the housing and inside the flange of the housing and (ii) secured to the housing. The sealant may be dispensed (i) through the open side of the housing and (ii) along a gap between the flange and the circuit board. The baseplate may be compressed to the housing thereby causing the sealant to flow between (i) the baseplate and the circuit board and (ii) the baseplate and the flange.