Jae Hoon Choi

US Patent:

7845849, Dec 7, 2010

Filed:

Apr 15, 2008

Appl. No.:

12/103389

Inventors:

Jae Choi - Westminster CO, US
Mark Woolley - Broomfield CO, US

Assignee:

Avaya Inc. - Basking Ridge NJ

International Classification:

G01K 1/00
G01N 25/00

US Classification:

374120, 374 5, 374 57, 374141

Abstract:

A pulse of heat or cold is applied and conducted transversely through a ball grid array device and a printed circuit board via a selected one of the solder joints between them. Heat diffused through the other solder joints is neutralized by a thermal bias shield. The shield is then removed and a thermographic image of the printed circuit board is taken. The process is repeated for each solder joint, and the images are compared to identify defective solder joints.

US Patent:

7991214, Aug 2, 2011

Filed:

Apr 18, 2007

Appl. No.:

11/737026

Inventors:

Jae H. Choi - Westminster CO, US
James E. Evans - Brighton CO, US
Matthew Gilhousen - Westminster CO, US
Mark D. Woolley - Broomfield CO, US

Assignee:

Avaya Inc. - Basking Ridge NJ

International Classification:

G06K 9/00

US Classification:

382141, 378 4, 250302

Abstract:

The present invention provides an image enhancer that can be applied to various materials during quality testing. The image enhancer is adapted to infiltrate cracks, crevices, fractures, fissures, and other faults, defects, or flaws in the material and provide an increased contrast for images taken by, for example, an X-ray imaging device.

US Patent:

8376209, Feb 19, 2013

Filed:

May 13, 2010

Appl. No.:

12/779848

Inventors:

Jae Choi - Westminster CO, US
Mark D. Woolley - Broomfield CO, US

Assignee:

Avaya Inc. - Basking Ridge NJ

International Classification:

B23K 31/12
G01N 25/00
G01N 25/72

US Classification:

228104, 228102, 228103, 374 5, 374120, 374124, 734321

Abstract:

Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.