Jae W Hwang

US Patent:

20210148950, May 20, 2021

Filed:

Jan 26, 2021

Appl. No.:

17/158441

Inventors:

Dong Weon Hwang - Gyeonggi-do, KR
Jae Suk Hwang - Berkeley CA, US
Jae Baek Hwang - Seoul, KR

International Classification:

G01R 1/067
G01R 31/28
G01R 1/04

Abstract:

The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

US Patent:

20210140997, May 13, 2021

Filed:

Jan 25, 2021

Appl. No.:

17/157538

Inventors:

Dong Weon Hwang - Gyeonggi-do, KR
Jae Suk Hwang - Berkeley CA, US
Jae Baek Hwang - Seoul, KR

International Classification:

G01R 1/067
G01R 31/28
G01R 1/04

Abstract:

The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

US Patent:

20200363399, Nov 19, 2020

Filed:

Dec 5, 2019

Appl. No.:

16/705064

Inventors:

- Los Angeles CA, US
Jae Youn Hwang - Los Angeles CA, US
Nan Sook Lee - Pasadena CA, US
K. Kirk Shung - Monterey Park CA, US
Andrew C. Weitz - Pasadena CA, US

International Classification:

G01N 33/50

Abstract:

A method of determining invasion potential of a tumor cell includes exposing a tumor cell to an activity sensor; after exposing the tumor cell to the activity sensor, stimulating the tumor cell to cause a response in the cell that is reported by the activity sensor; detecting the level of response after stimulation of the tumor cell; and determining the invasion potential of the tumor cell based on the response. A system for determining the invasion potential of a tumor cell includes a sample stage that supports the tumor cell; a stimulator that focuses energy on the tumor cell to stimulate the tumor cell; and an imaging apparatus that observes an effect of the beam on the tumor cell.

US Patent:

20190317128, Oct 17, 2019

Filed:

Aug 23, 2018

Appl. No.:

16/110045

Inventors:

Dong Weon Hwang - Gyeonggi-do, KR
Jae Suk Hwang - Berkeley CA, US
Jae Baek Hwang - Seoul, KR

International Classification:

G01R 1/067
G01R 1/04
G01R 31/26

Abstract:

Disclosed is related generally to a contact for testing a semiconductor device and a socket device therefor. The contact of the present invention, being a spring contact configured in an integrated body by blanking and bending a metal board, includes: an elastic part composed of various strips in a fixed pattern, and sharp end parts provided on opposite ends of the elastic part, respectively. Preferably, with a filler having conductivity and elasticity being filled in space volume, the contact of the present invention has excellent durability and electrical characteristics. In addition, the test socket according to the present invention, being the rubber type adopting the above-stated contacts, provides an appropriate effect for a test of a semiconductor device having a fine pitch.

US Patent:

20180348256, Dec 6, 2018

Filed:

Dec 6, 2017

Appl. No.:

15/833419

Inventors:

Dong Weon Hwang - Gyeonggi-do, KR
Jae Suk Hwang - Berkeley CA, US
Jae Baek Hwang - Seoul, KR

International Classification:

G01R 1/067
G01R 1/04
G01R 31/28

Abstract:

The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device.

US Patent:

20180143180, May 24, 2018

Filed:

Jun 7, 2017

Appl. No.:

15/616275

Inventors:

- Los Angeles CA, US
Jae Youn HWANG - Los Angeles CA, US
Nan Sook LEE - Pasadena CA, US
K. Kirk SHUNG - Monterey Park CA, US
Andrew C. WEITZ - Pasadena CA, US

International Classification:

G01N 33/50

Abstract:

A method of determining invasion potential of a tumor cell includes exposing a tumor cell to an activity sensor; after exposing the tumor cell to the activity sensor, stimulating the tumor cell to cause a response in the cell that is reported by the activity sensor; detecting the level of response after stimulation of the tumor cell; and determining the invasion potential of the tumor cell based on the response. A system for determining the invasion potential of a tumor cell includes a sample stage that supports the tumor cell; a stimulator that focuses energy on the tumor cell to stimulate the tumor cell; and an imaging apparatus that observes an effect of the beam on the tumor cell.

US Patent:

20170045551, Feb 16, 2017

Filed:

Apr 27, 2015

Appl. No.:

15/306151

Inventors:

Dong Weon HWANG - Seoul, KR
Jae Suk HWANG - Berkeley CA, US
Jae Baek HWANG - Berkeley, KR
- Seongnam-si, Gyeonggido, KR

Assignee:

HICON CO., LTD - Seongnam-si, Gyeonggido

International Classification:

G01R 1/04
G01R 31/26
G01R 31/28

Abstract:

Disclosed a socket apparatus for a semiconductor device test, the apparatus including: body elements () into which contacts () are inserted; movable elements () on which a semiconductor device (IC) is seated; a socket cover () assembled to the movable elements () and resiliently assembled to the body elements (); and a semiconductor device pressing part () pressing and fixing the semiconductor device (IC) seated on the movable elements (), wherein the semiconductor device pressing part () includes: a pusher plate () having an opening cam () and coming into surface contact with an upper surface of the semiconductor device (IC) and applies pressure thereto; a latch () of which ends are hingedly assembled to the socket cover () and the pusher plate (); and a link () of which ends are hingedly assembled to the socket body () and the latch ().

US Patent:

20150377925, Dec 31, 2015

Filed:

Jul 23, 2013

Appl. No.:

14/768012

Inventors:

Dong Weon HWANG - Gangnam-gu, Seoul, KR
Jae Suk HWANG - Berkeley CA, US
Jac Back HWANG - Gangnam-gu Seoul, KR
- Seongnam-si, Gyeonggi-do, KR

Assignee:

HICON CO., LTD. - Gyeonggi-do

International Classification:

G01R 1/067

Abstract:

The present invention relates to a spring contact, which is integrally formed by blanking and bending a metal plate member, the spring contact comprising: an upper head portion having an upper tip protruding upward; a spring portion () formed by a strip cylindrically bent, the strip extending in a zigzag pattern from an upper connection portion extending downward from the upper head portion ; a lower head portion extending downward from a lower connection extending from the lower end of the spring portion ; and a lower tip being provided on the lower end of the lower head portion . The present invention is advantageously suitable for manufacturing a fine-pitch spring contact and can improve productivity and reduce manufacturing costs.

Address:

540 S Kenmore Ave UNIT 506, Los Angeles, CA 90020

Phone:

(213)8424125

VIN:

KNAGM4AD5C5034175

Make:

KIA

Model:

OPTIMA HYBRID

Year:

2012