Jae D Shin

US Patent:

20110238763, Sep 29, 2011

Filed:

Feb 28, 2011

Appl. No.:

13/036052

Inventors:

Jae Whan Shin - Campbell CA, US
Zhiping Zheng - Irvine CA, US

Assignee:

Momo Networks, Inc. - Campbell CA

International Classification:

G06F 15/16

US Classification:

709206

Abstract:

A help item is received from a first user by using a social help network. The help item indicates a help service to be performed for the first user by a second user of the social help network, or by the first user for the second user. Factor(s) of the first user and other users of the social network are determined, such as a geographical location of each user. Factor(s) of the help item are determined, such as a geographical location where the help service is to be performed. Based on the factor(s) of each of the first user, the help item, and the other users, a search for potential second users is performed. Each potential second user can perform the help service for the first user, or each potential second user can have the help service performed by the first user.

US Patent:

20140254978, Sep 11, 2014

Filed:

Mar 7, 2013

Appl. No.:

13/789440

Inventors:

Brian Koch - San Carlos CA, US
Erik Norberg - Santa Barbara CA, US
Alexander W. Fang - Goleta CA, US
Jae Shin - Goleta CA, US
Gregory Alan Fish - Santa Barbara CA, US

International Classification:

H01L 21/822
G02B 6/13

US Classification:

385 14, 438 23

Abstract:

Embodiments of the invention describe photonic integrated circuits (PICs) formed using simultaneous fabrication operations performed on photonic device layers. Each device of a PIC may be made from different optimized materials by growing the materials separately, cutting pieces of the different materials and bonding these pieces to a shared wafer. Embodiments of the invention bond photonic device layers so that shared (i.e., common) processing operations may be utilized to make more than one device simultaneously. Embodiments of the invention allow for simpler, more cost effective fabrication of PICs and improve photonic device performance and reliability.