James M Brafford from Peoria, AZ, age 75

Us Patents

Integrated Circuit Tester Having A Fail-Safe Mechanism For Moving Ic-Chips
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US Patent:

6581486, Jun 24, 2003
Filed:

Oct 11, 2001
Appl. No.:

09/976416
Inventors:

David John Ditri - Oceanside CA
Ronald Allen Norell - Oceanside CA
James Mason Brafford - Mission Viejo CA
Assignee:

Unisys Corporation - Blue Bell PA
International Classification:

F16H 2520
US Classification:

74 8939, 74 8937, 74 8923, 324758, 41422201, 187267
Abstract:

An integrated circuit tester includes a fail-safe mechanism for moving an integrated circuit chip between an initial position where the integrated circuit chip is inserted into the tester, and a test position where the integrated circuit chips is actually tested. This fail-safe mechanism includes a motor and a shaft which the motor rotates to move the integrated circuit chip. An electronic control circuit can be included to automatically stop the motor when the integrated circuit reaches its initial position, or its test position; but if the control circuit fails to operate properly, then damage to the integrated circuit tester is prevented by the fail-safe mechanism.

System For Testing Multiple Groups Of Ic-Chips Which Concurrently Sends Time-Shifted Test Signals To The Groups
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US Patent:

6909299, Jun 21, 2005
Filed:

Nov 10, 2003
Appl. No.:

10/705368
Inventors:

Randy Neaman Siade - Chandler AZ, US
Terry Sinclair Connacher - Scottsdale AZ, US
James Vernon Rhodes - Chandler AZ, US
James Mason Brafford - Mission Viejo CA, US
John Charles Montgomery - Poway CA, US
David Jon Mortensen - Mission Viejo CA, US
Assignee:

Unisys Corporation - Blue Bell PA
International Classification:

G01R031/02
US Classification:

324755, 324760
Abstract:

An electromechanical system for testing IC-chips includes a total of N chip holding subassemblies; a moving mechanism for automatically moving the i-th chip holding subassembly from a load position in the system to the test position in the systems, and visa-versa, where i ranges from 1 to N and changes with time in a sequence; and a signal generator which sends test signals to the IC-chips at the test position. Between the moving of the i-th chip holding subassembly and the next subassembly in the sequence, test signals are sent to the IC-chips on all N of the chip holding subassemblies such that the signals are shifted in time from one subassembly to another. Also, while the i-th chip holding subassembly is being moved, the time shifted test signals continue to be sent to the IC-chips on the remaining N−1 chip holding subassemblies.

System For Testing A Group Of Ic-Chips Having A Chip Holding Subassembly That Is Built-In And Loaded/Unloaded Automatically
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US Patent:

6919718, Jul 19, 2005
Filed:

Nov 10, 2003
Appl. No.:

10/705369
Inventors:

Randy Neaman Siade - Chandler AZ, US
Terry Sinclair Connacher - Scottsdale AZ, US
James Vernon Rhodes - Chandler AZ, US
James Mason Brafford - Mission Viejo CA, US
John Charles Montgomery - Poway CA, US
David Jon Mortensen - Mission Viejo CA, US
Assignee:

Unisys Corporation - Blue Bell PA
International Classification:

G01R001/04
G01R031/26
US Classification:

3241581, 324765
Abstract:

An electromechanical system for testing IC-chips includes a chip holding subassembly which has sockets for holding a group of IC-modules that include the IC-chips; a moving mechanism for automatically moving the chip holding subassembly from a load position in the system to a test position in the system, and visa-versa; a temperature control mechanism which contacts the IC-modules on the chip holding subassembly only when that subassembly is at the test position; and a chip handler mechanism for automatically moving the IC-modules into and out of the sockets, when the chip holding subassembly is at the load position. At the test position, the temperature control mechanism contacts the IC-modules to control their temperature. At the load position, the chip handler mechanism automatically unloads one group of IC-modules from the sockets on the chip holding subassembly and automatically loads another group of the IC-modules into the sockets.

System For Testing One Or More Groups Of Ic-Chips While Concurrently Loading/Unloading Another Group
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US Patent:

6924636, Aug 2, 2005
Filed:

Nov 10, 2003
Appl. No.:

10/705524
Inventors:

Randy Neaman Siade - Chandler AZ, US
Terry Sinclair Connacher - Scottsdale AZ, US
James Vernon Rhodes - Chandler AZ, US
James Mason Brafford - Mission Viejo CA, US
John Charles Montgomery - Poway CA, US
David Jon Mortensen - Mission Viejo CA, US
Assignee:

Unisys Corporation - Blue Bell PA
International Classification:

G01R001/04
G01R031/26
US Classification:

3241581, 324765
Abstract:

An electromechanical system for testing IC-chips includes a total of N chip holding subassemblies, where N is an integer greater than one and where each chip holding subassembly has sockets for holding a group of IC-modules that include the IC-chips; a moving mechanism for automatically moving the i-th chip holding subassembly from a load position in the system to a test position in the system, and visa-versa, where i ranges from 1 to N and changes with time in a sequence; and a temperature control mechanism which contacts the IC-modules at the test position. Between the moving of the i-th chip holding subassembly and the next chip holding subassembly in the sequence, the IC-chips are burn-in tested on all N of the chip holding subassemblies. Also, while the i-th chip holding subassembly is being moved, burn-in testing of IC-chips on the remaining N-1 chip holding subassemblies continues.

Method Of Automatically Carrying Ic-Chips, On A Planar Array Of Vacuum Nozzles, To A Variable Target In A Chip Tester
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US Patent:

7355386, Apr 8, 2008
Filed:

Nov 18, 2005
Appl. No.:

11/282209
Inventors:

Randy Neaman Siade - Chandler AZ, US
James Mason Brafford - Mission Viejo CA, US
James Downie - Mission Viejo CA, US
Assignee:

Delta Design, Inc. - Poway CA
International Classification:

G01R 31/26
US Classification:

3241581, 324765
Abstract:

A method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester uses a set of laser distance sensors to align the vacuum nozzles with the target. Alignment occurs when certain combinations of distance and distance changes are sensed.

Quick-Release Spacer-Latching-Connector Assembly
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US Patent:

48445657, Jul 4, 1989
Filed:

Jan 11, 1988
Appl. No.:

7/141801
Inventors:

James M. Brafford - Mission Viejo CA
Ralph H. Maeda - El Toro CA
Assignee:

Unisys Corporation - Blue Bell PA
International Classification:

A47B 8700
US Classification:

3121075
Abstract:

A quick-set engaging and release spacer-connector assembly permits two cabinet modules to be fixedly connected side-by-side by manual operation of upper and lower internal lever handles which sit inside the assembly. A lateral drawing force operates to seal the cabinet modules with RFI/EMI gaskets on the periphery of each side of the spacer connector assembly.

Pivoting Springy Mechanism That Opens And Closes Pressed Electrical Contacts With A Force Which Is Nearly Constant Over A Range Of Closed Positions
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US Patent:

63073919, Oct 23, 2001
Filed:

Feb 23, 2000
Appl. No.:

9/511791
Inventors:

Jerry Ihor Tustaniwskyj - Mission Viejo CA
James Mason Brafford - Mission Viejo CA
Assignee:

Unisys Corporation - Blue Bell PA
International Classification:

G01R 3102
US Classification:

324760
Abstract:

An electromechanical apparatus for testing chips includes a pivoting springy mechanism which squeezes a chip holding subassembly between a temperature regulating subassembly and a power converter subassembly. This mechanism is comprised of a first arm that has a first pivotal joint, and a second arm that is coupled by a second pivotal joint to the first arm. An actuator is coupled to the first arm, and the actuator pivots the first arm from an open position to a closed position. In the open position, the angle between the arms is large; and the subassemblies are spaced apart. In the closed position, the angle between the arms is small but variable within a predetermined range; and the subassemblies are pressed together. This range of angles occurs due to various manufacturing tolerances and due to variable length stops that adjust the force with which the temperature regulating subassembly is pressed against the chip holding subassembly. A major feature of the pivoting springy mechanism is that it presses the subassemblies together with a force which stays relatively constant throughout the range of small angles for the closed position.

Electromechanical Apparatus For Testing Ic Chips Using First And Second Sets Of Substrates Which Are Pressed Together
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US Patent:

63073889, Oct 23, 2001
Filed:

Feb 23, 2000
Appl. No.:

9/511789
Inventors:

Lawrence William Friedrich - Escondido CA
Jerry Ihor Tustaniwskyj - Mission Viejo CA
James Mason Brafford - Mission Viejo CA
James Wittman Babcock - Escondido CA
Assignee:

Unisys Corporation - Blue Bell PA
International Classification:

G01R 3102
US Classification:

324754
Abstract:

An electromechanical apparatus for testing integrated chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly, which are squeezed together in multiple sets, by respective pressing mechanisms. One benefit which is achieved with this electromechanical apparatus is that by pressing the temperature regulating subassembly against the chip holding subassembly, heat can be added/removed from the chips by conduction; and thus the temperature of the chips can be regulated accurately. Another benefit which is achieved with this electromechanical apparatus is that by pressing the power converter subassembly against the chip holding subassembly, the distance between the chips that are tested and the power supplies for those chips is made small. Consequently, the chip voltages can easily be kept constant while the chip power dissipation changes rapidly as the chips are tested. Another benefit of this electromechanical apparatus is that physical contact between the three subassemblies is made quickly, and is broken quickly, by the pressing mechanisms.