James Joseph Matthews

US Patent:

6900509, May 31, 2005

Filed:

Sep 19, 2003

Appl. No.:

10/665660

Inventors:

Kendra Gallup - Marina Del Rey CA, US
Brenton A. Baugh - Palo Alto CA, US
Robert E. Wilson - Palo Alto CA, US
James A. Matthews - Milpitas CA, US
James H. Williams - Walnut Creek CA, US

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01L029/84

US Classification:

257414, 257 21

Abstract:

A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

US Patent:

6955934, Oct 18, 2005

Filed:

Sep 9, 2004

Appl. No.:

10/938291

Inventors:

Kendra Gallup - Marina Del Rey CA, US
Brenton A. Baugh - Palo Alto CA, US
Robert E. Wilson - Palo Alto CA, US
James A. Matthews - Milpitas CA, US
James H. Williams - Walnut Creek CA, US

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01L021/00

US Classification:

438 27, 438 26

Abstract:

A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

US Patent:

6982437, Jan 3, 2006

Filed:

Sep 19, 2003

Appl. No.:

10/665662

Inventors:

Kendra Gallup - Marina Del Rey CA, US
Brenton A. Baugh - Palo Alto CA, US
Robert E. Wilson - Palo Alto CA, US
James A. Matthews - Milpitas CA, US
James H. Williams - Walnut Creek CA, US
Tak Kui Wang - Saratoga CA, US

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H01L 33/00
H01L 31/0232

US Classification:

257100, 257432, 257434, 385 88, 372101, 372107

Abstract:

A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

US Patent:

7358109, Apr 15, 2008

Filed:

Nov 18, 2004

Appl. No.:

10/993894

Inventors:

Kendra Gallup - Marina Del Rey CA, US
Brenton A. Baugh - Palo Alto CA, US
Robert E. Wilson - Palo Alto CA, US
James A. Matthews - Milpitas CA, US
James H. Williams - Walnut Creek CA, US
Tak Kui Wang - Saratoga CA, US

International Classification:

H01L 21/00

US Classification:

438 65, 438 67, 438 69, 257E33056

Abstract:

A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

US Patent:

7520679, Apr 21, 2009

Filed:

Sep 19, 2003

Appl. No.:

10/665680

Inventors:

Kendra Gallup - Marina Del Rey CA, US
Brenton A. Baugh - Palo Alto CA, US
Robert E. Wilson - Palo Alto CA, US
James A. Matthews - Milpitas CA, US
Christopher L. Coleman - Santa Clara CA, US
Tanya J. Snyder - Edina MN, US
James H. Williams - Walnut Creek CA, US

Assignee:

Avago Technologies Fiber IP (Singapore) Pte. Ltd. - Singapore

International Classification:

G02B 6/36
H01S 3/00
G02B 6/32
H01L 21/00

US Classification:

385 88, 257 98, 257432, 257433, 372109, 385 33, 438106

Abstract:

An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

US Patent:

20050063431, Mar 24, 2005

Filed:

Sep 19, 2003

Appl. No.:

10/666442

Inventors:

Kendra Gallup - Marina del Rey CA, US
James Matthews - Milpitas CA, US

International Classification:

H01S003/04
H01L033/00

US Classification:

372034000, 257098000

Abstract:

An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a reflective material to form a 45 degree mirror. The mirror reflects a light from the laser to the lens and the light exits the optoelectronic device through the submount.

US Patent:

48507695, Jul 25, 1989

Filed:

Jun 8, 1987

Appl. No.:

7/059338

Inventors:

James R. Matthews - Hawthorne CA

International Classification:

B60P 708

US Classification:

410105

Abstract:

A tie-down device is disclosed herein having a movable car slidably carried on a stationary track which includes a spring biased vertically movable latch on the car operable to be insertably received into a selected one of a plurality of openings on said track for releasably retaining the car in a critical location on the track. The car further includes an attachment arrangement such as a tongue-in-groove construction for mounting on the track and a securement loop universally carried on a car flange for attachment to a tie-down line or cord.

US Patent:

D3100170, Aug 21, 1990

Filed:

Jun 8, 1987

Appl. No.:

7/059475

Inventors:

James R. Matthews - Hawthorne CA

US Classification:

D 8356