James P Moran

US Patent:

54606837, Oct 24, 1995

Filed:

Aug 19, 1994

Appl. No.:

8/292859

Inventors:

William E. Beasley - Durham NC
John P. Sarbell - Grand Island FL
James W. Moran - Marlton NJ

Assignee:

Sumitomo Electric Lightwave Corp. - Research Triangle Park NC

International Classification:

B32B 3500

US Classification:

156344

Abstract:

A method of removing the encapsulant matrix from a selected span of optical ribbon fiber to provide access to one or more selected optical fibers wherein a strip of adhesive tape having a plastic card element attached to one end thereof is placed on a support surface with an adhesive surface of the strip of tape facing upwardly. A selected span of optical ribbon fiber is placed across the exposed top surface of the strip of tape and across the plastic card element. A selected amount of glue is positioned beneath the span length of the optical ribbon fiber overlaying the plastic card element so as to bond the optical ribbon fiber to a portion thereof. Next, the end of the optical ribbon fiber overlaying the plastic card element is lifted so as to initiate delamination of the encapsulant matrix from the optical fibers of the optical ribbon fiber, and the delamination caused by the tension on the glue bond is propagated by lifting the span length of the optical fiber which overlays the exposed surface of the strip of tape. Thus, the optical fibers contained within the optical ribbon fiber are removed from the encapsulant matrix by applying the delamination procedure to one or both sides of the optical ribbon fiber as may be required.

US Patent:

48524417, Aug 1, 1989

Filed:

Jul 22, 1987

Appl. No.:

7/076406

Inventors:

Gary H. Anders - Euless TX
James A. Moran - Irving TX

Assignee:

Frito-Lay, Inc. - Dallas TX

International Classification:

B26D 706
B26D 328

US Classification:

83155

Abstract:

Apparatus for slicing a food piece includes at least one stationary feeding channel for serially feeding food pieces. The feeding channel has a feed outlet through which food pieces pass prior to slicing thereof. At least one moving slicing assembly including a first planar support surface on which the food piece exiting the feed outlet rests prior to a slice being cut is provided, the first support surface being disposed at a distance below the feed outlet about equal to the desired slice thickness. The fixed slicing blade is maintained at a set distance from the first support surface and adjacent to the feed outlet to sever a slice from the food piece, the distance between the first support surface and the slicing blade defining a slice exit through which individual slices exit the slicing assembly. A blade holder is provided having a second planar support surface contingent to the slicing blade and extending in an opposing direction from the first support surface, on which the food piece rests while a slice is being cut. The slicing assembly further includes a slice-throwing surface for throwing slices away from the slice exit during movement of the slicing assembly past the feed outlet.

US Patent:

54606829, Oct 24, 1995

Filed:

Jun 16, 1994

Appl. No.:

8/260713

Inventors:

William E. Beasley - Durham NC
James W. Moran - Marlton NJ
Thomas A. Morrison - Cary NC
John P. Sarbell - Grand Island FL

Assignee:

Sumitomo Electric Lightwave Corp. - Research Triangle Park NC

International Classification:

B32B 3500

US Classification:

156344

Abstract:

A method of midspan or end entry accessing of one or more selected optical fibers carried by an optical ribbon fiber. The top and bottom surfaces of a first selected span of the optical ribbon fiber are friction abraded to initiate delamination of the bond between the optical fibers and the matrix encapsulant. The delamination is completed by applying a rolling force to the circumference of the first selected span, and the delamination is then propagated by introducing the first selected span into the bore of a die element and urging the die element along a relatively longer second selected span of the optical ribbon fiber. With the delamination completed, the tip of an elongated tool is inserted through the encapsulant within the second selected span and between one or more selected optical fibers and the remaining optical fibers within the optical ribbon fiber. Next, the tip of the elongated tool is lifted from within the encapsulant so as to remove the one or more selected optical fibers from the encapsulant, and the elongated tool inserted between the encapsulant and the one or more selected optical fibers. Finally, the elongated tool is slidably urged along the length of the delaminated second selected span to lift the optical fibers out of the encapsulant for access as necessary.

US Patent:

57954283, Aug 18, 1998

Filed:

Feb 4, 1997

Appl. No.:

8/795467

Inventors:

William E. Beasley - Durham NC
John P. Sarbell - Grand Island FL
James W. Moran - Marlton NJ

Assignee:

Sumitomo Electric Lightwave Corp. - Durham NC

International Classification:

B32B 3500

US Classification:

156344

Abstract:

A method of removing the encapsulant matrix from a selected span of optical ribbon fiber to provide access to one or more selected optical fibers wherein a strip of adhesive tape having a plastic card element attached to one end thereof is placed on a support surface with an adhesive surface of the strip of tape facing upwardly. A selected span of optical ribbon fiber is placed across the exposed top surface of the strip of tape and across the plastic card element. A selected amount of glue is positioned beneath the span length of the optical ribbon fiber overlaying the plastic card element so as to bond the optical ribbon fiber to a portion thereof. Next, the end of the optical ribbon fiber overlaying the plastic card element is lifted so as to initiate delamination of the encapsulant matrix from the optical fibers of the optical ribbon fiber, and the delamination caused by the tension on the glue bond is propagated by lifting the span length of the optical fiber which overlays the exposed surface of the strip of tape. Thus, the optical fibers contained within the optical ribbon fiber are removed from the encapsulant matrix by applying the delamination procedure to one or both sides of the optical ribbon fiber as may be required.