James J Pickering

US Patent:

6441084, Aug 27, 2002

Filed:

Apr 11, 2000

Appl. No.:

09/547278

Inventors:

Chun D. Lee - Cincinnati OH
James J. Pickering - Mason OH

Assignee:

Equistar Chemicals, LP - Houston TX

International Classification:

C08K 300

US Classification:

524495, 524496

Abstract:

Semi-conductive compositions useful for extrusion coating wire and cable are provided. The semi-conductive extrusion coating compositions of the invention utilize a base resin containing linear low density polyethylene and a combination of a higher structure conductive carbon black and a lower structure conductive carbon black. The linear low density polyethylene may be combined with other polyolefin resins, such as low density polyethylene. The resulting semi-conductive compositions have a useful balance of processability and thermomechanical stability and physical/mechanical properties making make them particularly well-suited for use as conductive layers for power cable constructions.