James N Ramsey

US Patent:

7914313, Mar 29, 2011

Filed:

Feb 4, 2010

Appl. No.:

12/700610

Inventors:

James M. Ramsey - Frisco TX, US

Assignee:

Plastronics Socket Partners, Ltd. - Irving TX

International Classification:

H01R 13/62

US Classification:

439330, 439 71

Abstract:

A clamping mechanism () for an IC socket () is disclosed having two moveable arms () which are spaced apart on opposite sides of the IC socket (), with first ends pivotally secured to a fixed shaft () at moveable arm pivot points for moving from a lifted position to a lowered position, extending across the IC socket (). Two clamp arms () are spaced apart on opposite sides of the IC socket (), and have formed ends () pivotally secured to the second ends () of the moveable arms () at latch pivot points. The clamp arms () are configured such that, when the moveable arms () are disposed in the lowered positions and the clamp arms () are disposed in the clamping positions, a hooking shaft () is disposed in the self-locking positions in openings () in the clamp arms () such that upward forces applied to the moveable arms () will engage the hooking shaft () against the clamp arms () and urge the clamp arms () into the latched position.

US Patent:

8491315, Jul 23, 2013

Filed:

Nov 29, 2011

Appl. No.:

13/306979

Inventors:

James M. Ramsey - Frisco TX, US
Jose L. Ortega - Irving TX, US

Assignee:

Plastronics Socket Partners, Ltd. - Irving TX

International Classification:

H01R 12/00

US Classification:

439 66, 439 71

Abstract:

A micro via adapter socket () is provided by a printed circuit board () having an upper layer (), a lower layer () and intermediate interconnect layers ( and ). The lower layer () has an array of mini vias () formed therein for receiving respective ones of mini-springs (). A top plate () is secured above the upper layer (). The top plate () has a plurality of micro-pin recesses () spaced apart for registering with respective ones of the micro vias () and receiving micro-pins (). A bottom plate () is secured beneath the lower layer (). The bottom plate () has a plurality of mini-pin recesses () for removably receiving respective ones of the mini-pins (). The intermediate interconnect layers ( and ) have conductive tracks () which electrically connect between the micro vias () and the mini vias ().

US Patent:

8591270, Nov 26, 2013

Filed:

Apr 4, 2012

Appl. No.:

13/439764

Inventors:

James M Ramsey - Frisco TX, US
Jose L. Ortega - Bedford TX, US

Assignee:

Plastronics Socket Partners, Ltd. - Irving TX

International Classification:

H01R 13/24

US Classification:

439824, 439700

Abstract:

A spring contact () has a tail contact () and a tip contact () which are secured together in a telescoping arrangement. The tail contact () is formed as a first single element member () having two contact arms () which are spaced apart and extend forward to engage the tip contact (). Two contact protuberances () extend outward from respective edges the two contact arms (). The tip contact () is formed of a second single element member () having two elongate sides () and a mounting protrusion () which rearwardly extend in parallel toward the tail contact (). The two sides () extend in a cantilever arrangement and have two elongate slots () formed therein for receiving respective ones of the contact protuberances ().

Address:

404 E Scotland Dr, Irving, TX 75062

VIN:

4HFBC14167A700185

Make:

Buick

Model:

Terraza 4dr CXL *Ltd Ava

Year:

2007