James E Renfro

US Patent:

20170031115, Feb 2, 2017

Filed:

Jul 21, 2016

Appl. No.:

15/216136

Inventors:

- Hickory NC, US
Michael John Yadlowsky - Sunnyvale CA, US
James Gavon Renfro - Pacifica CA, US
Ian Armour McKay - Mountain View CA, US

International Classification:

G02B 6/42
G02B 6/12

Abstract:

A method to manufacture optoelectronic modules comprises a step of providing a first wafer comprising a plurality of first module portions, wherein each of the first module portions comprises at least one passive optical component, providing a second wafer comprising a plurality of second module portions, wherein each of the second module portions comprises at least one optoelectronic component. The wafers are disposed on each other to provide a wafer stack that is diced into individual optoelectronic modules respectively comprising one of the first and the second and the third module portions.