James S Robbins

US Patent:

7682370, Mar 23, 2010

Filed:

Sep 19, 2003

Appl. No.:

10/665754

Inventors:

James J. Pagliuca - Millis MA, US
John D. Unger - Wrentham MA, US
James E. Robbins - North Attleboro MA, US
Thomas W. Davison - Naples FL, US
Adam Sher - Franklin MA, US

Assignee:

Zimmer Spine, Inc. - Minneapolis MN

International Classification:

A61M 29/00

US Classification:

606191, 604104, 604264

Abstract:

A surgical tool for use in expanding a tubular structure having an inner surface defining a passage through the tubular structure for receiving surgical instruments includes a first leg having a first end engageable with the inner surface of the tubular structure. A second leg has a second end engageable with the inner surface of the tubular structure. The first and second ends are movable away from each other to apply a radially outwardly directed force to the inner surface of the tubular structure and cause expansion of the tubular structure to increase a cross-sectional area of the passage along a portion of the passage.

US Patent:

8581406, Nov 12, 2013

Filed:

Apr 20, 2012

Appl. No.:

13/452114

Inventors:

James A. Robbins - Groton MA, US
William J. Davis - Hollis NH, US
Robert B. Hallock - Newtown NH, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01L 23/48
H01L 29/76
H01L 23/10

US Classification:

257751, 257288, 257706

Abstract:

A MMIC flip chip mounted to a circuit board having an underfill material disposed between the MMIC and the circuit board and a barrier structure for preventing the underfill material from being disposed under an electronic device of the MMIC while providing a cavity under the electronic device.

US Patent:

20120313818, Dec 13, 2012

Filed:

Nov 14, 2011

Appl. No.:

13/295437

Inventors:

Angelo M. Puzella - Marlborough MA, US
Patricia S. Dupuis - Medway MA, US
Craig C. Lemmler - Medway MA, US
Donald A. Bozza - Billerica MA, US
Kassam K. Bellahrossi - Pelham NH, US
James A. Robbins - Groton MA, US
John B. Francis - Littleton MA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01Q 21/00

US Classification:

342371

Abstract:

In one aspect, an active electronically scanned array (AESA) card includes a printed wiring board (PWB) that includes a first set of metal layers used to provide RF signal distribution, a second set of metal layers used to provide digital logical distribution, a third set of metal layers used to provide power distribution and a fourth set of metal layers used to provide RF signal distribution. The PWB comprises at least one transmit/receive (T/R) channel used in an AESA.

US Patent:

20160248392, Aug 25, 2016

Filed:

Feb 23, 2015

Appl. No.:

14/628917

Inventors:

- Waltham MA, US
James A. Robbins - Merrimac MA, US
Jonathan B. Langille - Boston MA, US
Philip M. Henault - Medway MA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H03F 3/60
H03F 3/21

Abstract:

A power amplifier structure having: a power divider for dividing power in a signal fed to an input port between a pair of output ports. Each one of a pair of amplifiers has: an input coupled to a corresponding one of the pair of power divider output ports; and an output. A power combiner is provided. Signals at the power divider output ports are fed to the inputs of the pair of amplifiers in a forward direction and then pass through the amplifiers in the forward direction towards the outputs of the pair of amplifiers. Connectors direct the signals at the amplifier outputs to the power combiners, the signal then passing through the power combiner to an output port in a direction opposite to the forward direction.

US Patent:

20150015453, Jan 15, 2015

Filed:

Oct 3, 2014

Appl. No.:

14/505980

Inventors:

- Waltham MA, US
Donald A. Bozza - Billerica MA, US
James R. Robbins - Merrimac MA, US
John B. Francis - Littleton MA, US

International Classification:

H01Q 21/00
H05K 1/02
H01P 1/38

US Classification:

343853, 333 11

Abstract:

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.