James William Shipley

US Patent:

7083449, Aug 1, 2006

Filed:

Mar 29, 2005

Appl. No.:

11/092114

Inventors:

Javier Leija - Chandler AZ, US
James C Shipley - Gilbert AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 13/62

US Classification:

439160

Abstract:

In general, in one aspect, the disclosure describes an apparatus that includes a latch to connect a board to a chassis. The apparatus further includes a pull lever to control whether said latch is retracted or extended. The latch connects the board to the chassis when it is extended.

US Patent:

7209364, Apr 24, 2007

Filed:

Dec 29, 2004

Appl. No.:

11/024625

Inventors:

James C. Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A. Gonzales - Chandler AZ, US
Christopher D. Lucero - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/14

US Classification:

361801, 361759, 361747, 361740, 361732, 361726

Abstract:

A method according to one embodiment may include providing a circuit board assembly comprising a circuit board and a rotatable knob and at least one latch coupled to the knob via a linkage. The method of this embodiment may also include moving the at least one latch to a retracted position by rotating the knob, and inserting the circuit board assembly into a chassis. The method may then include moving the latch to an extended position. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.

US Patent:

7215552, May 8, 2007

Filed:

Mar 23, 2005

Appl. No.:

11/087256

Inventors:

James C Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361721, 361695, 361719, 165 802, 16510433, 165122, 174 161, 454184

Abstract:

In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region to allow airflow to pass therethrough. At least some of the airflow limited by the at least one restriction region will flow through the open region. The apparatus also includes a connection mechanism to connect to a chassis.

US Patent:

7316606, Jan 8, 2008

Filed:

Feb 8, 2005

Appl. No.:

11/053727

Inventors:

James C Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 5/00

US Classification:

454184, 454185, 361695, 361696, 312236

Abstract:

A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

US Patent:

7864541, Jan 4, 2011

Filed:

Jan 12, 2010

Appl. No.:

12/686255

Inventors:

Christopher D. Lucero - Chandler AZ, US
Javier Leija - Chandler AZ, US
James C. Shipley - Gilbert AZ, US
Christopher A. Gonzales - Chandler AZ, US

Assignee:

Radisys Corporation - Hillsboro OR

International Classification:

H05K 5/00

US Classification:

361752, 361800, 361687

Abstract:

A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

US Patent:

20030000690, Jan 2, 2003

Filed:

Jun 28, 2001

Appl. No.:

09/894259

Inventors:

Chia-Pin Chiu - Tempe AZ, US
James Shipley - Gilbert AZ, US
Craig Simmons - Woodland Park CO, US

Assignee:

Intel Corporation

International Classification:

F28F007/00
H01B001/00
H01C001/00

US Classification:

165/185000, 252/500000

Abstract:

A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.

US Patent:

20040060691, Apr 1, 2004

Filed:

Sep 26, 2003

Appl. No.:

10/672121

Inventors:

Chia-Pin Chiu - Tempe AZ, US
James Shipley - Gilbert AZ, US
Craig Simmons - Woodland Park CO, US

Assignee:

Intel Corporation

International Classification:

F28F007/00

US Classification:

165/185000

Abstract:

A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.

US Patent:

20060120038, Jun 8, 2006

Filed:

Dec 6, 2004

Appl. No.:

11/005910

Inventors:

Christopher Lucero - Chandler AZ, US
Javier Leija - Chandler AZ, US
James Shipley - Gilbert AZ, US
Christopher Gonzales - Chandler AZ, US

International Classification:

H05K 7/20

US Classification:

361694000

Abstract:

A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.