James David Walling

US Patent:

6792171, Sep 14, 2004

Filed:

Nov 14, 2003

Appl. No.:

10/713377

Inventors:

Marian C. Hargis - Rochester MN
David Peter Gaio - Rochester MN
Christopher M. Gabel - Rochester MN
James Walling - West Melbourne FL
Philip Deane - Satellite Beach FL
William K Hogan - Rochester MN

Assignee:

JDS Uniphase Corporation - San Jose CA

International Classification:

G02B 612

US Classification:

385 14, 385 92, 385 94, 385 88

Abstract:

The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host a transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

US Patent:

7160039, Jan 9, 2007

Filed:

Jan 25, 2005

Appl. No.:

11/042868

Inventors:

Marian C. Hargis - Rochester MN, US
David Peter Gaio - Rochester MN, US
Roger T. Lindquist - Dodge Center MN, US
William K. Hogan - Merritt Island FL, US
James Walling - West Melbourne FL, US
Sundeep Nangalia - Raleigh NC, US
Philip Deane - Indian Harbour Beach FL, US
Miles F. Swain - Hayfield MN, US
Christopher M. Gabel - Rochester MN, US

Assignee:

JDS Uniphase Corporation - Milpitas CA

International Classification:

G02B 6/36
H05K 1/14
H05K 5/00

US Classification:

385 93, 385 88, 385 92, 361736, 361752, 361756

Abstract:

The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e. g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.