Robert D. Lee - Denton TX Gary V. Zanders - Fairview TX James Walling - Frisco TX Steven N. Hass - Carrollton TX
Assignee:
Dallas Semiconductor Corporation - Dallas TX
International Classification:
H01L 1012
US Classification:
338309
Abstract:
A metalization layer formed as part of a bump connection/flip chip process for a semiconductor circuit is also used to form a sense resistor or other passive components. The metalization layers normal composition can also be altered so as to change or control the value of the so formed resistor or to improve the temperature stability of the resistor. Other passive components such as capacitors or inductor can also be formed in this layer.
Bainbridge-Guilford High School Bainbridge NY 1999-2003
Community:
Joann Hedman, Herbert Stevens, Kelly Herbert, Bobbi Darlin, Krista Lorenzen, Jim Vanderheide, Stacey Dibble, Tanya Reynolds, Michael Cuomo, Kevin Mcclain, William Obrien