Jamie Burns

US Patent:

20140213061, Jul 31, 2014

Filed:

Jan 30, 2013

Appl. No.:

13/754068

Inventors:

- Fremont CA, US
Duane D. Scott - Centerville OH, US
Joseph P. Doench - Mason OH, US
Jamie Burns - Richmond IN, US
Emily P. Stenta - Lebanon OH, US
Gregory R. Bettencourt - Fremont CA, US
John E. Daugherty - Fremont CA, US

Assignee:

LAM RESEARCH CORPORATION - Fremont CA

International Classification:

H01L 21/3065
B23B 35/00
B28D 1/14

US Classification:

438710, 408 1 R, 408 1 BD, 2940208, 29428

Abstract:

A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 μm.