Janet F Devine

US Patent:

40882578, May 9, 1978

Filed:

Feb 14, 1977

Appl. No.:

5/768458

Inventors:

Janet Devine - West Chester PA

Assignee:

Christiana Metals Corporation - West Chester PA

International Classification:

B23K 106
B23K 520

US Classification:

228110

Abstract:

An ultrasonic spot welder is disclosed with a reed of resonant length arranged to be vibrated in a flexural mode for spot welding both plastics and metals. The reed has a non-circular cross section with major and minor transverse dimensions. Vibratory energy is transmitted to the reed in a direction perpendicular to its major transverse dimension.

US Patent:

44096593, Oct 11, 1983

Filed:

Dec 15, 1980

Appl. No.:

6/216081

Inventors:

Janet Devine - Downingtown PA

Assignee:

Sonobond Ultrasonics, Inc.

International Classification:

G06F 1546

US Classification:

364475

Abstract:

This method provides methods and apparatus for programmably regulating power provided to ultrasonically vibrate a metal-cutting tool, with power being regulated as a function of physical parameters measured during the cutting operation which are indicative of progress of the tool cutting the workpiece. The methods and apparatus regulate the power input to vibrate the tool in response to one or more sensed physical parameters to maintain the parameter(s) within preselected limits indicative of satisfactory cutting by the tool.

US Patent:

45012857, Feb 26, 1985

Filed:

Apr 5, 1982

Appl. No.:

6/365569

Inventors:

Charles Irwin - Santa Ana CA
Janet Devine - Downingtown PA
Richard Kramer - Wilmington DE

Assignee:

Sonobond Ultrasonics, Inc. - PA

International Classification:

B08B 312

US Classification:

134 58R

Abstract:

Ultrasonic transducer apparatus for cleaning applications and method for cleaning wafers of semiconductor material in which the method includes positioning the wafer proximate to but closely spaced away from a cleansing face of the ultrasonic transducer, supplying space between the cleansing face and the wafer with a cleansing fluid through an orifice in the cleansing surface and ultrasonically vibrating the cleansing face transversely to the wafer by applying an electrical signal to piezoelectric material symmetrically disposed about the orifice in the cleansing face via which the cleansing fluid is supplied, with the ultrasonic transducer including piezoelectric material symmetrically disposed with respect to the orifice in the cleansing face through which the cleansing fluid is supplied. The piezoelectric material is preferably in the form of a plurality of discreet piezoelectric elements which are provided with an input signal via a common input terminal where all of the plurality of piezoelectric elements are mechanically coupled to the cleansing face so that the piezoelectric elements, the mechanical coupling structure and a cleansing face ultrasonically vibrate as a single integral structure.