Jason Lee Sanders

US Patent:

6770326, Aug 3, 2004

Filed:

Jul 3, 2002

Appl. No.:

10/190110

Inventors:

Jason L. Sanders - Indianapolis IN
George E. Sears - Indianapolis IN

Assignee:

Lord Corporation - Cary NC

International Classification:

B05D 302

US Classification:

427387, 524404, 524428, 524430, 524432, 524437, 524588, 528 31, 528 32

Abstract:

Disclosed is a thermally conductive silicone gel is produced by reacting a stoichiometric excess of a multifunctional vinyl-substituted silicone with a multifunctional hydride-substituted silicone. The thermal conductive components comprise at least three conductive solid fillers, aluminum oxide, zinc oxide and boron nitride. The invention is adaptable to spin casting for encapsulating electronic circuitry, among other uses.

US Patent:

20020098369, Jul 25, 2002

Filed:

May 26, 1999

Appl. No.:

09/320208

Inventors:

JASON L. SANDERS - INDIANAPOLIS IN, US
GEORGE E. SEARS - INDIANAPOLIS IN, US

International Classification:

B32B005/16
C08K003/08
B32B027/30

US Classification:

428/484000, 524/272000, 524/274000, 524/439000, 524/440000, 524/441000, 428/328000, 428/522000, 428/209000

Abstract:

A phase change composition that is useful as a thermally conductive interface composition between a heat sink and an electronic component that includes: (a) at least one ethylene polymer; (b) at least one tackifier; (c) at least one wax; and (d) at least one thermally conductive metal filler, wherein the composition is a solid at 25 C., begins to melt at about 35 to 80 C., and turns to a liquid at about 45 to 110 C.