Jeffrey Lyle Christensen

US Patent:

6405891, Jun 18, 2002

Filed:

Apr 23, 2001

Appl. No.:

09/840391

Inventors:

Warren J. Christensen - Salt Lake City UT 84121
Jeffrey Christensen - Sandy UT
Kip M. Colton - West Valley City UT
Stephen Matthew Haws - Provo UT
Michelle Elaine Lau - Provo UT
Janet Heidemarie Lehnardt - Springville UT
Kevin David Staples - Provo UT
Alaa Abu-Obeid - Provo UT
Len Pugh - Mapleton UT

Assignee:

Warren J. Christensen - Salt Lake City UT

International Classification:

B65D 2500

US Classification:

220484

Abstract:

A rake storage device for storing a rake adjacent a sand trap of a golf course, and for selectively elevating the rake for use, includes an elongated container disposed underground in a substantially vertical orientation. The rake is removably received within the container. The device includes lifting means for elevating the rake out of the container and above the surface. The lifting means can include a rake receiver and a counter-weight operatively coupled together and movably disposed in the elongated container.

US Patent:

58924175, Apr 6, 1999

Filed:

Dec 27, 1996

Appl. No.:

8/775074

Inventors:

Gary Carl Johnson - Tempe AZ
Michael J. Anderson - Phoenix AZ
Gregory Jon Kennison - Mesa AZ
Jeffrey Eanes Christensen - Scottsdale AZ
Mark Phillip Popovich - Gilbert AZ

Assignee:

Motorola Inc. - Schaumburg IL

International Classification:

H03H 905
H01L 41053

US Classification:

333193

Abstract:

A method for packaging an acoustic wave filter die, and an acoustic wave filter die packaged by the method. The method includes steps of providing an acoustic wave filter die having an active area disposed on a first surface thereof, providing a leadframe including a die flag and sealing the first surface to the die flag. The method also includes steps of molding a plastic package body about the die and the die flag and singulating the plastic body, the die and the die flag. The molding step desirably includes substeps of placing the acoustic wave filter die sealed to the leadframe in a mold, applying a thermosetting plastic material at a suitable temperature less than the glass transition temperature and at a suitable pressure to the acoustic wave filter die sealed to the leadframe in the mold and maintaining the suitable temperature for a suitable period of time.

US Patent:

59694610, Oct 19, 1999

Filed:

Apr 8, 1998

Appl. No.:

9/057144

Inventors:

Michael J. Anderson - Phoenix AZ
Gregory Kennison - Mesa AZ
Jeffrey E. Christensen - Scottsdale AZ
Gary C. Johnson - Tempe AZ
Jon G. Aday - Gilbert AZ

Assignee:

CTS Corporation - Elkhart IN

International Classification:

H01L 4108
H03H 925

US Classification:

310313R

Abstract:

A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.