Jeffrey L Herman

US Patent:

20020184401, Dec 5, 2002

Filed:

Oct 22, 2001

Appl. No.:

10/039306

Inventors:

Richard Kadel - San Diego CA, US
Jeffrey Herman - San Diego CA, US
Christopher Exline - San Diego CA, US
David Almilli - La Mesa CA, US
Christopher Priebe - San Diego CA, US

International Classification:

G06F009/44

US Classification:

709/315000

Abstract:

A framework enables data source components to be developed independently of data consumer components. A mediation layer, typically implemented as a group of APIs (application programming interface), handles and defines the mediation and interface between the source and data components. The framework, called XIS (extensible information system), is especially suited for development of information-handling systems and applications. Data source components and data consumer components are typically designed to communicate with each other via several interfaces. Domain, relationship, attribute/metadata, and change event interfaces are defined within the mediation layer. Other interfaces may also be defined. Data source components that are written for non-XIS aware environments or frameworks may still be used with XIS by “wrapping” such source components with code to conform to the interface requirements. Java objects are examples of data source components. Data consumer components thus are able to use or consume various source components regardless of the data types and the data source. Thus, once a data consumer component is developed within the XIS framework, any data source components within the XIS framework may be consumed by a data consumer component.

US Patent:

20220349046, Nov 3, 2022

Filed:

Jul 12, 2022

Appl. No.:

17/863272

Inventors:

- San Diego CA, US
Andrew Edmonds - Oceanside CA, US
Jeffrey Herman - Solana Beach CA, US
Charles Pateros - Carlsbad CA, US
Kareemullah Shaik - San Diego CA, US
Edward White - San Diego CA, US

International Classification:

C23C 16/04
B33Y 30/00
C25D 17/00
C23C 14/04
C23C 14/14
C23C 14/08
C25D 5/10
C23C 16/27

Abstract:

Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

US Patent:

20230089135, Mar 23, 2023

Filed:

Aug 30, 2022

Appl. No.:

17/823227

Inventors:

- San Diego CA, US
Jeffrey Herman - San Diego CA, US
Kareemullah Shaik - San Diego CA, US
Andrew Edmonds - San Diego CA, US

Assignee:

Fabric8Labs, Inc. - San Diego CA

International Classification:

C25D 1/00
B33Y 10/00
B33Y 30/00

Abstract:

Described herein are electrochemical additive manufacturing systems and methods of using such systems. In some examples, a method comprises flowing an electrolyte solution into the gap formed by an electrode array and a deposition electrode and depositing (electroplating) a target material onto the deposition electrode. The method also comprises changing one or more characteristics of the electrolyte solution within the system, e.g., to remove deposition byproducts, replenish consumed components, and/or change the solution composition to modify various properties of the deposited target material (e.g., composition, morphology) without major changeovers within the system. These electrolyte changes can be performed dynamically while the system continues to operate. The changed characteristics can be acid concentration, feedstock ion concentration, additive concentration, temperature, and flow rate. In some examples, the solution is flowed into the gap from a supply reservoir and recirculated back into the supply reservoir after exiting the gap.

US Patent:

20230079959, Mar 16, 2023

Filed:

Nov 23, 2022

Appl. No.:

17/993277

Inventors:

- San Diego CA, US
Andrew Edmonds - Oceanside CA, US
Jeffrey Herman - Solana Beach CA, US
Charles Pateros - Carlsbad CA, US
David Wirth - San Diego CA, US
Kareemullah Shaik - San Diego CA, US

International Classification:

C25D 1/00
B33Y 50/02
B33Y 30/00
B33Y 10/00

Abstract:

Printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts; embodiments utilize a grid of anodes to achieve high quality parts with features that may be small and detailed. To support grids with thousands or millions of anodes, the printhead may use matrix control with row and column drivers similar to display backplanes. Unlike display backplanes where the design goal is to display images using minimal current, the printhead may be optimized for high current density for fast electrodeposition, and for anode longevity. Current density may exceed 1000 mA per cm-squared, at least an order of magnitude greater than that of display backplanes. Anode longevity may be enhanced by using relatively large anodes compared to the grid pitch of the printhead, by lengthening the conductive paths through anodes, or both. Embodiments may be constructed by adding anode and insulation layers on top of matrix-controlled switching circuits.

US Patent:

20230070048, Mar 9, 2023

Filed:

Sep 6, 2022

Appl. No.:

17/903966

Inventors:

- San Diego CA, US
Ian Winfield - Oceanside CA, US
Andrew Edmonds - Oceanside CA, US
Kareem Shaik - San Diego CA, US
Jeffrey Herman - Solana Beach CA, US
Michael Matthews - Encinitas CA, US
Charles Pateros - Carlsbad CA, US

International Classification:

C25D 1/00
C25D 5/10
C25D 21/12
C25D 17/12
C25D 5/00

Abstract:

An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.

US Patent:

20230059846, Feb 23, 2023

Filed:

Nov 7, 2022

Appl. No.:

17/982338

Inventors:

- San Diego CA, US
Andrew Edmonds - Oceanside CA, US
Jeffrey Herman - Solana Beach CA, US
Charles Pateros - Carlsbad CA, US
Kareemullah Shaik - San Diego CA, US

International Classification:

H01L 21/48
C25D 1/00
C25D 5/10
C25D 5/22

Abstract:

A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

US Patent:

20210102286, Apr 8, 2021

Filed:

Nov 16, 2020

Appl. No.:

17/099602

Inventors:

- San Diego CA, US
Andrew EDMONDS - Oceanside CA, US
Jeffrey HERMAN - Solana Beach CA, US
Charles PATEROS - Carlsbad CA, US
Kareemullah SHAIK - San Diego CA, US
Edward WHITE - San Diego CA, US

Assignee:

FABRIC8LABS, INC. - San Diego CA

International Classification:

C23C 16/04
C23C 14/04
C23C 16/27
C25D 17/00
C25D 5/10
B33Y 30/00
C23C 14/08
C23C 14/14

Abstract:

3D metal printhead assembly method of manufacture that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

US Patent:

20210090901, Mar 25, 2021

Filed:

Dec 4, 2020

Appl. No.:

17/112909

Inventors:

- San Diego CA, US
Andrew EDMONDS - Oceanside CA, US
Jeffrey HERMAN - Solana Beach CA, US
Charles PATEROS - Carlsbad CA, US
Kareemullah SHAIK - San Diego CA, US

Assignee:

FABRIC8LABS, INC. - San Diego CA

International Classification:

H01L 21/48
C25D 1/00
C25D 5/22
C25D 5/10

Abstract:

A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.