Jeffrey H Ramirez

US Patent:

20060219563, Oct 5, 2006

Filed:

Apr 1, 2005

Appl. No.:

11/097787

Inventors:

William Sepp - Mission Viejo CA, US
Jeffrey Ramirez - Yorba Linda CA, US
Fred Hayward - Seal Beach CA, US
Daniel Gramarossa - Las Vegas NV, US

International Classification:

C25D 5/00
C23F 13/00
C23C 28/00

US Classification:

205080000, 204196080, 205198000

Abstract:

A processing system, electroplating cell, and method of reducing the ration (i.e., demarcation line) that often forms on articles undergoing a partial plating process. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, an anode electrode, a support structure, which may be part of the transport system, to support the articles such that only a portion thereof is immersed in the plating fluid bath and an air flow system adapted to cause air flow proximate the interface of the articles to the plating fluid bath. The air flow near the articles prevents or reduces plating fluid vapors from impinging the articles, thereby reducing the discoloration that would otherwise form on the articles.