Jeffrey N Walker

US Patent:

6825560, Nov 30, 2004

Filed:

May 22, 2003

Appl. No.:

10/443277

Inventors:

Jeffrey Scott Walker - High Point NC
Joseph Byron Bullis - Graham NC

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

H01L 2940

US Classification:

257746, 257737, 257778

Abstract:

The present invention relates to electrically attaching a surface mount device to mounting structure via their respective contact pads using an attach material, such as solder or conductive epoxy, which includes a filler material. In general, the filler material is relatively solid and granular shaped, wherein the diameter of the filler material controls a mounting distance between the surface mount device and the mounting structure. The filler allows a desired distance to be maintained during initial placement of the surface mount device and any subsequent reheating.

US Patent:

8061012, Nov 22, 2011

Filed:

Dec 7, 2007

Appl. No.:

11/952690

Inventors:

Dan Carey - Kernersville NC, US
Jeffrey Scott Walker - Oak Ridge NC, US
Gary D. Messner - King NC, US

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

B23P 17/00
H05K 9/00

US Classification:

29592, 29830, 29831, 29832, 29845, 29874, 361818

Abstract:

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

US Patent:

8296938, Oct 30, 2012

Filed:

Oct 27, 2010

Appl. No.:

12/913364

Inventors:

Dan Carey - Kernersville NC, US
Jeffrey Scott Walker - Oak Ridge NC, US
Gary D. Messner - King NC, US

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

H05K 3/36

US Classification:

29830, 29412, 29841, 361816

Abstract:

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

US Patent:

8359739, Jan 29, 2013

Filed:

Dec 7, 2007

Appl. No.:

11/952670

Inventors:

Dan Carey - Kernersville NC, US
Jeffrey Scott Walker - Oak Ridge NC, US
Gary D. Messner - King NC, US

Assignee:

RF Micro Devices, Inc. - Greensboro NC

International Classification:

H05K 3/30
H05K 5/00

US Classification:

29832, 29825, 29830, 29833, 361730

Abstract:

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.