Jerry R Hurst

US Patent:

51717093, Dec 15, 1992

Filed:

Oct 4, 1991

Appl. No.:

7/770838

Inventors:

John J. Donelon - Mahopac NY
James P. Doyle - Bronx NY
Jerry E. Hurst - San Jose CA
Stephen M. Rossnagel - White Plains NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2126
H01L 21465
C01B 3100

US Classification:

437173

Abstract:

The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using a thin conductive layer formed within the surface of a substrate and laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material is described, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.

US Patent:

51822300, Jan 26, 1993

Filed:

Jul 25, 1988

Appl. No.:

7/223487

Inventors:

John J. Donelon - Mahopac NY
James P. Doyle - Bronx NY
Jerry E. Hurst - San Jose CA
Modest M. Oprysko - Mahopac NY
Stephen M. Rossnagel - White Plains NY
Robert J. von Gutfeld - New York NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2126
H01L 21465
C01B 3100

US Classification:

437173

Abstract:

The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material is described, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.