Jerry D Thietje

US Patent:

54683025, Nov 21, 1995

Filed:

Jul 13, 1994

Appl. No.:

8/274250

Inventors:

Jerry Thietje - Wallkill NY

International Classification:

B08B 302

US Classification:

134 1

Abstract:

A semiconductor wafer high purity cleaning apparatus for cleaning large semiconductor wafers of 200 mm in diameter and is intended for circuitry in small geometric structures of 0. 3 Microns or less. The apparatus includes successively arranged wafer loading, washing, drying and unloading stations, each having an individual closable enclosure. Also included in the apparatus is a device for storing a number of wafers in a vertical plane within the enclosures of the loading and unloading stations, a device for transporting a sequence of individual wafers, a device for rotating the wafers and a high pressure jet for simultaneously cleaning opposite surfaces of the wafers.