Jerry L Wright

US Patent:

8300424, Oct 30, 2012

Filed:

Nov 25, 2008

Appl. No.:

12/277430

Inventors:

Jerry Wright - Huntsville AL, US
David L. McDonald - Lacey's Spring AL, US

Assignee:

GE Intelligent Platforms Embedded Systems, Inc. - Charlottesville VA

International Classification:

H05K 7/14

US Classification:

361796

Abstract:

A mounting bracket for securing a mezzanine card in a stacked single board computer includes a main body that includes a first end, an opposite second end, a first side surface, and an opposite second side surface. The main body is sized to be positioned along a side surface of the mezzanine card, wherein the first side surface or the second side surface contacts the side surface of the mezzanine card to facilitate securing the side surface of the mezzanine card with respect to a top PCB. The mounting bracket also includes a first arm formed at the first end of the main body, a second arm formed at the second end of the main body, and at least one top rail coupled to the main body, wherein the top rail is configured to secure a top surface of the mezzanine card with respect to a top PCB.

US Patent:

8482929, Jul 9, 2013

Filed:

May 17, 2011

Appl. No.:

13/109253

Inventors:

David S. Slaton - Huntsville AL, US
David McDonald - Huntsville AL, US
Jerry L. Wright - Huntsville AL, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H05K 7/20

US Classification:

361759, 36167954, 361761, 174252, 174548, 174562

Abstract:

A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.

US Patent:

20170164459, Jun 8, 2017

Filed:

Dec 4, 2015

Appl. No.:

14/959553

Inventors:

- Schenectady NY, US
Michelle Ann Parziale - Madison AL, US
Jerry Leon Wright - Flintville TN, US
Hendrik Pieter Jacobus de Bock - Clifton Park NY, US
Brian Patrick Hoden - Huntsville AL, US

International Classification:

H05K 1/02
H05K 13/04
H05K 7/20

Abstract:

A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

US Patent:

20170147044, May 25, 2017

Filed:

Nov 23, 2015

Appl. No.:

14/949075

Inventors:

- Schenectady NY, US
Jerry Leon Wright - Huntsville AL, US
Brian Patrick Hoden - Huntsville AL, US

International Classification:

G06F 1/20

Abstract:

Disclosed herein are systems and methods for the thermal regulation of on-board electronic components using a mezzanine filler module. The mezzanine filler module connects at a mezzanine site of the circuit board to provide an additional thermal conduction path for thermal energy released, at least, from component located under the mezzanine site.