Jesse Allen Clark

US Patent:

60722304, Jun 6, 2000

Filed:

Sep 9, 1997

Appl. No.:

8/926150

Inventors:

Buford H. Carter - Richardson TX
Jesse E. Clark - Carrollton TX
David R. Kee - Richardson TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 23495
H01L 2348

US Classification:

257666

Abstract:

The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segments connecting said chip mount pad with said leadframe. The latter plurality of segments has a geometry designed so as to tolerate bending and stretching beyond the limit of simple elongation based upon the inherent material characteristics. The chip mount pad of said leadframe provides direct thermal contact to an external heat conductor or heat sink by being designed so as to extend through the encapsulating package. The exposed chip pad can also be used electrically as a ground connection.

US Patent:

55942342, Jan 14, 1997

Filed:

Nov 14, 1994

Appl. No.:

8/337798

Inventors:

Buford H. Carter - Richardson TX
Dennis D. Davis - Garland TX
David R. Kee - Richardson TX
Jesse Clark - Farmers Branch TX
Steven P. Laverde - Dallas TX
Hai Tran - Cedarhill TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 23495

US Classification:

257676

Abstract:

The invention is a single piece deep downset exposed lead frame (10) that can be used in current production processes. A single lead frame (10) has a die mount pad (12) that is formed with a downset or cavity into which the semiconductor die (20) is mounted. Wings (14, 15, 17, 18) lock the die pad in the device package (21) and increase the length of potential moisture paths (34a). The downset die pad (12) provides direct thermal contact of the die mount pad (12) to an external heat sink, eliminating the need for a heat slug internal to the package. The exposed die pad (12) can also be used as an RF ground connection to an RF circuit ground plane.