Jesse J Coleman

US Patent:

8342690, Jan 1, 2013

Filed:

Apr 29, 2010

Appl. No.:

12/770081

Inventors:

Jesse J. Coleman - Caledonia NY, US
James Mazzarella - Fairport NY, US
James R. Kircher - Mendon NY, US

Assignee:

Eastman Kodak Company - Rochester NY

International Classification:

G03B 21/26

US Classification:

353 34, 165185

Abstract:

A light modulation assembly for a digital projection apparatus comprising: a solid-state light source that provides an illumination beam; a spatial light modulator having a plurality of tiltable micro-mirrors, each micro-mirror being actuable to tilt with respect to a tilt axis between a first tilt position that provides on-state light and a second tilt position that provides off state light, and wherein the micro-mirrors deflect the illumination beam along an arced path defining a deflection plane as they are tilted between the first tilt position and the second tilt position; and a light baffle disposed alongside the optical axis and in the path of the off state light from the micro-mirrors, the light baffle having a light-trapping surface adapted to absorb the off-state light from the micro-mirrors on the spatial light modulator, the light-trapping surface having a plurality of protruding fins that extend outward from the light-trapping surface at an oblique angle.

US Patent:

20050184662, Aug 25, 2005

Filed:

Feb 24, 2004

Appl. No.:

10/785825

Inventors:

Ronald Cok - Rochester NY, US
Jesse Coleman - Caledonia NY, US
Andrew Arnold - Hilton NY, US

International Classification:

H05B033/04
H05B033/00

US Classification:

313512000, 313504000, 313506000, 313511000

Abstract:

An OLED display comprises a substrate; one or more OLED light emitting elements including a first electrode formed on the substrate, one or more OLED light emissive layers located over the first electrode, and a second electrode located over the OLED light emissive layers; an encapsulating cover located over the second electrode; and a thermally conductive substantially planar backplate extending over an exterior surface of the encapsulating cover or of the substrate and adhered thereto with a thermally conductive adhesive, the backplate having a thermal conductivity higher than that of the substrate or cover, and the adhesive having a thermal conductivity of greater than 0.2 W/mK, or equal to or greater than the thermal conductivity of the cover or substrate to which it is adhered.