Ji Li

US Patent:

20130266274, Oct 10, 2013

Filed:

Apr 8, 2013

Appl. No.:

13/858932

Inventors:

- New Taipei, TW
YUAN-CHIEH LIN - Lake Forest CA, US
JIM ZHAO - Irvine CA, US
GANG PAUL CHEN - Walnut CA, US
JIE ZHENG - Rowland-Heights CA, US
JI LI - West Covina CA, US
AN-JEN YANG - Irvine CA, US

Assignee:

HON HAI PRECISION INDUSTRY CO., LTD. - New Taipei

International Classification:

G02B 6/42
G02B 6/43

US Classification:

385 89

Abstract:

An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.