Skills:
Semiconductor Fabrication Skills: Scanning Electron Microscopy (SEM) (XL30-FEG Philips), E-Beam Lithography (EBL) (Leo 1550), E Beam Evaporator (Temescal BJD-1800), Focused Ion Beam (FIB) (Leo XB1540), Deep Reactive Ion Etching (RIE) (STS Multiplex RIE), Photolithography Processing (Karl Suss MA6 & Quintel Q-4000 series).,Chemical Vapor Deposition (Unaxis PECVD &LPCVD), Atomic Layer Deposition (ALD) (Cambridge Nanotech), Rapid Thermal Annealer (MPT 600S), Wet Bench, Spin coater. Characterization: I-V, C-V Characterizer (Agilent 4284), Raman spectroscopy (Renishaw RM 2000, Horiba), Atomic force microscopy (AFM) (Veeco Dimension5000), 1/f noise Spectral Analyzer (SR-785).Energy Dispersive Analysis using X-rays (EDX). Thermal management Measurement (Laser Flash-LFA 447, Hot disc Technique) Software: TCAD Sentaurus, COMSOL, Cadence Virtuoso, Rhino, Origin. Cadence/Synopsys, Quartus/Modelsim, PSPICE Programming: C/C++, Verilog / VHDL, MATLAB, Perl, JAVA Scripts