Joann M Vigil

US Patent:

7921552, Apr 12, 2011

Filed:

Jul 20, 2009

Appl. No.:

12/505774

Inventors:

JoAnn C. Vigil - Longmont CO, US
Robert Gibson-Taylor - Firestone CO, US

Assignee:

Seagate Technology LLC - Scotts Valley CA

International Classification:

H05K 13/00

US Classification:

29832, 295921, 29760, 206561, 206564, 206565, 206718, 206707, 206725, 228 495

Abstract:

A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.

US Patent:

20070209828, Sep 13, 2007

Filed:

Mar 8, 2007

Appl. No.:

11/683537

Inventors:

JoAnn C. Vigil - Longmont CO, US
Robert Gibson-Taylor - Firestone CO, US

Assignee:

Maxtor Corporation - Scotts Valley CA

International Classification:

H05K 1/00

US Classification:

174250

Abstract:

A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.