John C Ackerman

US Patent:

20020086452, Jul 4, 2002

Filed:

Dec 28, 2000

Appl. No.:

09/749692

Inventors:

Gary Kneezel - Webster NY, US
Daniel Kuhman - Fairport NY, US
Brian Ormond - Webster NY, US
John Ackerman - Rochester NY, US
Almon Fisher - Rochester NY, US
Allan Camp - Brockport NY, US
Lawrence Herko - Palmyra NY, US

International Classification:

H01L021/00
H01L021/30

US Classification:

438/021000, 438/455000, 438/459000, 438/460000

Abstract:

A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.

US Patent:

53091795, May 3, 1994

Filed:

Aug 18, 1992

Appl. No.:

7/931798

Inventors:

Lawrence K. Agbezuge - Penfield NY
Thomas N. Taylor - Rochester NY
John G. Ackerman - Webster NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

B41J 219

US Classification:

346140R

Abstract:

An enhanced duct apparatus provides enhanced re-establishment of ink fluid flow between an ink reservoir and printheads when, for example, ink supply tubing located therebetween is filled with slugs of ink which prevent the flow from being established. The apparatus requires minimal head pressure, thus reducing reservoir depth, by including a high surface energy material within the tubing. Preferably, the material is in the form of a spring which may be of stainless steel. This inclusion of a high surface energy material is more readily wetted by the ink and allows substantially instantaneous overcoming of impedance, including adhesive, surface tension, and wetting forces, upon initiating opening of fluid flow from the reservoir through the duct.

US Patent:

62913174, Sep 18, 2001

Filed:

Dec 6, 2000

Appl. No.:

9/730819

Inventors:

Nicholas J. Salatino - Penfield NY
John C. Ackerman - Rochester NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

H01L 2146
H01L 2178
H01L 21301

US Classification:

438462

Abstract:

A method for dicing small devices including MEMS, ink jet printheads, lasers etc. The method comprises making a first pass cut into a substrate with a blade of narrow kerf and having long wear characteristics. This first pass cut is then followed with a polishing blade of wider kerf having desirable smooth cutting qualities.

US Patent:

55554610, Sep 10, 1996

Filed:

Jan 3, 1994

Appl. No.:

8/176925

Inventors:

John C. Ackerman - Webster NY

Assignee:

Xerox Corporation - Stamford CT

International Classification:

B41J 2165

US Classification:

347 33

Abstract:

A self cleaning wiper blade cleaning system has at least one polyurethane wiping blade releasably mounted in a slot on a planar surface of a fixed structural member. A front end of the mounted blade wipes the nozzle face of the printhead as it enters and leaves a priming station to maintain the printhead nozzle face clear of ink and other debris. The ink which is removed from the printhead nozzle face by the edge of the wiper blade is drawn away therefrom by capillary action of small grooves cut in the wiper blade. The grooves have one end in contact with an absorbent pad provided at a bottom edge of the wiper blade and the other end of the slot is adjacent but spaced a predetermined distance from the front edge of the wiper blade. The capillary action of the grooves provide continuous removal of the ink from the vicinity of cleaning edge of the wiper blade, obviating the need of a separate system to clean the wiper blades. The grooves are so small that the beam strength and thus the cleaning force of the wiper blade is not significantly affected.