John M Arthur

US Patent:

20150145148, May 28, 2015

Filed:

Nov 26, 2013

Appl. No.:

14/090086

Inventors:

- Austin TX, US
John G. Arthur - Austin TX, US
Yin Kheng Au - Petaling Jaya, MY
Chu-Chung Lee - Round Rock TX, US
Chin Teck Siong - Shah Alam, MY
Meijiang Song - Tianjin, CN
Jia Lin Yap - Klang, MY
Matthew J. Zapico - Cedar Park TX, US

Assignee:

FREESCALE SEMICONDUCTOR, INC. - Austin TX

International Classification:

H01L 23/00

US Classification:

257780, 2281101

Abstract:

An integrated circuit copper wire bond connection is provided having a copper ball () bonded directly to an aluminum bond pad () formed on a low-k dielectric layer () to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location () under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.