John W Ayres

US Patent:

20030198427, Oct 23, 2003

Filed:

Dec 18, 2002

Appl. No.:

10/323126

Inventors:

William Bragg - Plano TX, US
Peter Stokes - Indian Harbour Beach FL, US
John Ayres - Forney TX, US

International Classification:

G02B006/26
G02B006/43

US Classification:

385/014000, 385/089000

Abstract:

A flexible optical circuit comprising passive or active components is provided. The flexible optical circuit includes a first optical fiber having both first and second ends, a second optical fiber having both first and second ends, a flexible substrate attached to both the first and second optical fibers where the first and second pins of the first and second optical fibers extend to at least the edge of the flexible substrate and a component coupled to the first optical fiber between the first and second ends. The component can be used passive or active. A passive component requires no electrical trace lines to activate the component and the passive component will react upon the reception of a light-wave signal. The active component will require power from the back plane before the active component can modify or affect the light-wave signal. The first and second ends of the optical fibers extend at least to the edge of the flexible optical circuit or can extend beyond the edge of the flexible substrate. The flexible optical fibers can be fixedly attached to the flexible substrate through an adhesive or the flexible optical fibers can be intermittently fixedly attached to the flexible substrate.

US Patent:

20040033079, Feb 19, 2004

Filed:

Jun 4, 2003

Appl. No.:

10/455774

Inventors:

Samir Sheth - Dallas TX, US
Marvin Young - Richardson TX, US
Jeffrey Cox - Fairview TX, US
John Ayres - Forney TX, US

International Classification:

H04B010/24

US Classification:

398/135000

Abstract:

The invention is relevant to optical fiber transmission systems, and in particular, pertains to the transceiver cards in an optical fiber transport system. In particular the invention teaches an improved transceiver card architecture that allows high density, flexibility and interchangeability of functionality.

US Patent:

6302781, Oct 16, 2001

Filed:

Jun 7, 1999

Appl. No.:

9/327235

Inventors:

John W. Ayres - Forney TX
Vincent M. Byrne - Mesquite TX
Edward C. Fontana - Rockwall TX
Steven C. Stein - Dallas TX

International Classification:

H05K 720

US Classification:

454184

Abstract:

A faceplate for a chassis composed of a moldable material and various methods of fabricating and assembling the faceplate into a fan-cooled electronics enclosure. In one embodiment, the faceplate includes: (1) a chassis mount adapted to cooperate with a corresponding first faceplate mount on the chassis to register the faceplate with respect to the chassis, (2) a fan mount adapted to cooperate with a corresponding second faceplate mount on a fan to register the faceplate with respect to the chassis and (3) a grille proximate the fan mount, the chassis mount and the fan mount cooperating to affix the fan to the chassis when the faceplate is mounted to the chassis.

US Patent:

62016997, Mar 13, 2001

Filed:

Mar 1, 1999

Appl. No.:

9/259772

Inventors:

John W. Ayres - Forney TX
Vincent Byrne - Mesquite TX
Edward C. Fontana - Rockwall TX
Steven C. Stein - Dallas TX

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H05K 720

US Classification:

361707

Abstract:

The present invention provides a heat sink that, in an advantageous embodiment, includes a spine having a width with first and second opposing sides that are oriented to be abnormal to the substrate when the heat sink is mounted on the substrate. The heat sink further includes an electronic device support leg that extends generally transverse from the first side and that is configured to support a heat generating electrical component thereon. Alternative embodiments of the present invention may include a plurality of such electronic device support legs. A plurality of cooling fins are also included in the present invention, extending from the second side. Moreover, each of the plurality of cooling fins has a depth that is substantially less than the width of the heat sink, which give this unique heat sink an exceptional cooling efficiency. In particular advantageous embodiments, the depth to width ratio of the fins and spine, may range from about 1 to 5 or 1 to 10, respectively.

US Patent:

63301601, Dec 11, 2001

Filed:

Jul 25, 2000

Appl. No.:

9/625679

Inventors:

John W. Ayres - Forney TX
Susan M. Ayres - Forney TX
Vincent M. Byrne - Mesquite TX
Edward C. Fontana - Rockwall TX

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H05K 720

US Classification:

361707

Abstract:

The present invention is directed to a mounting clip for electronic components and, more specifically, to a component retention spring clip for securing electronic components to an electronic device support such as the leg of a heat sink. In one embodiment the component retention clip is comprised of a resilient strip that has an arcuate portion and first and second ends. The resilient strip is configured to encompass an electronic component and an electronic device support adjacent to the electronic component. The arcuate portion of the component retention clip contacts a portion of the electronic component, thereby partially supporting the electronic component against the electronic device support. Located at the first end of the resilient strip is a first latch configured to cooperatively engage a corresponding second latch located at the second end and retain the electronic component on the electronic device support.

US Patent:

63207494, Nov 20, 2001

Filed:

Aug 30, 1999

Appl. No.:

9/385153

Inventors:

John W. Ayres - Forney TX
Vincent Byrne - Mesquite TX
Timothy F. Conway - Rockwall TX
Edward C. Fontana - Rockwall TX

International Classification:

H05K 500
H05K 504
H05K 506

US Classification:

361730

Abstract:

The present invention provides a receptacle configured to receive an electronics module for use with an electronics equipment chassis. In one embodiment, the receptacle has a torsion bar, to which is coupled a first planar sidewall with a boss located on an inside planar surface, the boss configured to cooperatively engage a first notch formed on a rear wall of an electronics module. The first sidewall also has a locking slot formed in its front edge lo configured to receive a first locking cam associated with the electronics module, the locking slot cooperating with the locking cam and the boss to create a longitudinal compressive force along the first planar sidewall. A second planar sidewall opposing the first planar sidewall is coupled to the torsion bar.