John W Cassen

US Patent:

7583238, Sep 1, 2009

Filed:

Jan 19, 2007

Appl. No.:

11/624726

Inventors:

John Cassen - Sykesville MD, US
Timothy G. Waterman - Eldersburg MD, US

Assignee:

Northrop Grumman Systems Corporation - Los Angeles CA

International Classification:

H01Q 1/42

US Classification:

343872, 343753, 343756, 343895

Abstract:

The present invention provides a radome for an endfire antenna array that includes a honeycomb core, an inner skin attached to the honeycomb core, a first set of conductive slats disposed on the inner skin of the honeycomb core and a second set of conductive slats that are disposed within the honeycomb core. The two sets of conductive slats are capacitively-coupled to one another.

US Patent:

62784005, Aug 21, 2001

Filed:

Nov 29, 1999

Appl. No.:

9/450905

Inventors:

John W. Cassen - Sykesville MD
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Pasadena MD
David A. Herlihy - Ellicott City MD
Scott C. Tolle - Baltimore MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD
Timothy L. Eder - Glen Burnie MD
Chad E. Wilson - Redmond WA
Gary L. Ferrell - Pasadena MD
Stephanie A. Parks - Virginia Beach VA

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package.

US Patent:

60055316, Dec 21, 1999

Filed:

Sep 23, 1998

Appl. No.:

9/158827

Inventors:

John W. Cassen - Sykesville MD
Gary N. Bonadies - Laurel MD
Patrick K. Richard - Baltimore MD
David A. Herlihy - Ellicott City MD
Ayn U. Fuller - Greenbelt MD
Daniel H. Wenzlick - Linthicum MD
Richard C. Kapraun - Baltimore MD
Mark R. Schrote - Ellicott City MD
Kerry M. Yon - Beltsville MD
H. Halley Lisle - Monrovia MD
Toby Hess - Olney MD
Edward L. Rich - Arnold MD
George T. Hall - Catonsville MD
Brian T. Drude - Arbutus MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

H01Q 2100

US Classification:

343853

Abstract:

An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.

US Patent:

51755602, Dec 29, 1992

Filed:

Mar 25, 1991

Appl. No.:

7/674003

Inventors:

Eric W. Lucas - Ellicott City MD
Michael A. Mongilio - Columbia MD
Kenneth M. Leader - Glen Burnie MD
Charles P. Stieneke - Cary NC
John W. Cassen - Sykesville MD

Assignee:

Westinghouse Electric Corp. - Pittsburgh PA

International Classification:

H01Q 1310

US Classification:

343767

Abstract:

A planar dielectric substrate supports a stripline conductor therein. A conductive housing has one or more recesses for receiving a dielectric and a conductive cover is mountable over the dielectric in contact with the housing to enclose the dielectric and isolate the stripline from adjacent structures. The housing and cover have aligned slots disposed on opposite sides of the dielectric and transverse to the stripline for providing coupling of signals between the stripline and the slot. An aperture is formed in the housing in communication with the slot. Other embodiments of the invention include impedance matching means for either or both of the stripline and the aperture for optimizing the efficiency measured in terms of VSWR of the radiator.

US Patent:

60941618, Jul 25, 2000

Filed:

Dec 8, 1999

Appl. No.:

9/456407

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Severna Park MD
David A. Herlihy - Ellicott City MD
Andrew J. Piloto - San Diego CA
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate.

US Patent:

60346337, Mar 7, 2000

Filed:

Sep 23, 1998

Appl. No.:

9/158832

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Severna Park MD
David A. Herlihy - Ellicott City MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

US Patent:

60973358, Aug 1, 2000

Filed:

Dec 8, 1999

Appl. No.:

9/456330

Inventors:

John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Pasadena MD
David A. Herlihy - Ellicott City MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD

Assignee:

Northrop Grumman Corporation - Los Angeles CA

International Classification:

G01S 728

US Classification:

342175

Abstract:

A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

US Patent:

45477760, Oct 15, 1985

Filed:

Nov 3, 1983

Appl. No.:

6/548468

Inventors:

Conway A. Bolt - Pasadena MD
John W. Cassen - Glen Burnie MD
Helmut E. Schrank - Cockeysville MD

Assignee:

The United States of America as represented by the Secretary of the Navy - Washington DC

International Classification:

H01Q 1114

US Classification:

343741

Abstract:

Loop radiating elements for microwave frequencies which result in balanced ower division at the feed points and equi-phase currents in the radiating segments are in the form of an Alford loop design having a "kink" in the stripline path on the side of a printed circuit board opposite the cross-over to restore equal path lengths on both sides of a central feed terminal. Alternatively, the radiating segments of a loop may be in the form of end-loaded bent dipoles which are dual-fed on diametrically opposite points of the loop with equi-phase and amplitude signal. The result is loop radiating elements which have an axial null with a symmetrical doughnut radiating pattern.