John Micheal Cleveland

US Patent:

8273994, Sep 25, 2012

Filed:

Dec 28, 2009

Appl. No.:

12/647737

Inventors:

Boris Reynov - Cupertino CA, US
Ping Yue - San Jose CA, US
Shreeram Siddhaye - Sunnyvale CA, US
John Cleveland - Cupertino CA, US
Chebrolu Srinivas - San Jose CA, US
Srinivas Venkataraman - Santa Clara CA, US

Assignee:

Juniper Networks, Inc. - Sunnyvale CA

International Classification:

H05K 1/11
H05K 7/00
H05K 1/18

US Classification:

174261, 174262, 361777, 361778, 361779

Abstract:

A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA pad and is rotated diagonally relative to a center of the first BGA pad. The PCB also includes a second BGA pad having a circular shape, and a second via having a circular shape, where the circular shape of the second via overlaps a portion of the circular shape of the second BGA pad and is rotated diagonally relative to a center of the second pad, and where a center of the second via is located at a first distance from the center of the first via and at a first angle relative to an axis that crosses a center of the first via.