John L Colbert

US Patent:

6385044, May 7, 2002

Filed:

Jul 27, 2001

Appl. No.:

09/917446

Inventors:

John Lee Colbert - Byron MN
Roger Duane Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind Kumar Sinha - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361700, 361704, 361699, 361707, 361709, 257714, 257718, 257719, 257727, 174 152, 165 804, 16510434, 165185

Abstract:

An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.

US Patent:

6449155, Sep 10, 2002

Filed:

Aug 9, 2001

Appl. No.:

09/927056

Inventors:

John Lee Colbert - Byron MN
Roger Duane Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind Kumar Sinha - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361704, 361707, 361709, 361712, 361715, 361718, 165 802, 165 803, 165185, 174 163, 257718, 257719

Abstract:

A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.

US Patent:

6475011, Nov 5, 2002

Filed:

Sep 7, 2001

Appl. No.:

09/948195

Inventors:

Arvind K. Sinha - Rochester MN
Roger D. Hamilton - Eyota MN
John L. Colbert - Byron MN
Danny E. Massey - Austin TX

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1362

US Classification:

439330, 439 762, 439342

Abstract:

An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.

US Patent:

6480391, Nov 12, 2002

Filed:

Jan 12, 2000

Appl. No.:

09/481521

Inventors:

William Michael Monson - Rochester MN
John Lee Colbert - Byron MN
Steven Dale Greseth - Rochester MN
Mark G. Clark - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 500

US Classification:

361752, 361724, 361725, 361753, 361756, 361788, 361796, 361829, 3122231, 3122232, 3122656, 3122571

Abstract:

A cage for an electronic component includes two spaced apart cast walls, and a roof member and a floor member connected to the two spaced apart cast walls. The walls are substantially identical, and the roof member and the floor member are each formed of a damped metallic laminate panel.

US Patent:

6561554, May 13, 2003

Filed:

Jul 2, 2001

Appl. No.:

09/897547

Inventors:

John Lee Colbert - Byron MN
Steven Dale Greseth - Rochester MN
William Michael Monson - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

E05C 1910

US Classification:

292 87, 292128, 292228

Abstract:

A latch assembly for a computer or other electronic device includes a lever which is adapted to receive a spring arm integrally molded with a latch. The latch also includes integrally molded pivot pins which are guided by ramps into pivot holes in the lever to mate the latch and lever together. Once assembled, the latch is movable to and between engaged and disengaged positions for closure with a catch on the computer, electronic or other workpiece device. The latch assembly incorporates specific changes to existing parts while reducing the number of parts and the cost of and complexity for assembly. The design is much more easily accommodated in automated assembly equipment to further reduce assembly costs and increase productivity throughput.

US Patent:

6634095, Oct 21, 2003

Filed:

Jun 27, 2001

Appl. No.:

09/892967

Inventors:

John L. Colbert - Byron MN
Roger D. Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind K. Sinha - Rochester MN
Charles C. Stratton - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23P 1900

US Classification:

29740, 29760, 29832, 257726, 257727, 269199, 269229, 269903

Abstract:

An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

US Patent:

6757965, Jul 6, 2004

Filed:

Jun 5, 2003

Appl. No.:

10/455538

Inventors:

John L. Colbert - Byron MN
Roger D. Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind K. Sinha - Rochester MN
Charles C. Stratton - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 330

US Classification:

29836, 29174, 29837, 361709

Abstract:

A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

US Patent:

6792375, Sep 14, 2004

Filed:

Nov 1, 2002

Appl. No.:

10/286193

Inventors:

John Lee Colbert - Byron MN
Roger Duane Hamilton - Eyota MN
Arvind Kumar Sinha - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 1900

US Classification:

702117, 439 91, 439591, 714726, 714 30

Abstract:

A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.