An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
Electromagnetic Interference Shield For Electronic Devices
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
An EMI and RFI shield mounting system includes a compartmented EMI shield constructed of a vacuum metallized thermoform having upright hollow walls separating and surrounding the compartments. The shield conforms to the interior of a housing for electronic equipment, with the upright walls overlying ridges formed in the interior of the housing. A compressible gasket is placed between the ridges of the housing and the inner reaches of the hollow walls of the shield. The free sides of the walls of the shield may be abutted against ground traces on a printed circuit board on which the shield and housing are placed. The gasket urges the metallized free edges of the walls of the shield against the ground trace of the printed circuit board to provide electrical conductivity between the printed circuit board and the shield. Dimples, tabs or protruding punctures may be formed in the free sides of the walls to ensure conductive contact with the ground trace.
Electromagnetic Interference Shields For Electronic Devices
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
John Zarganis - Redwood City CA, US Rocky Arnold - San Carlos CA, US John Gabower - Mauston WI, US
Assignee:
Shielding for Electronics, Inc. - Sunnyvale CA
International Classification:
H05K009/00
US Classification:
174/0350MS
Abstract:
The present invention provides electromagnetic interference filters and gaskets. In exemplary embodiments, the filters and gaskets are made from conductively coated reticulated foam having a pore density varying from 10 to 40 pores per inch (PPI). The filters can be used to cover ventilation openings in an electronics enclosure to shield electrical components, equipment and devices from EMI, electrostatic discharge (ESD) and radio frequency interference (RFI) while still providing adequate airflow to enter and cool the system. The filter material may also help prevent dust and dirt from entering the enclosure. The filters of the present invention are also well suited to conductively bridge gaps between mating features of electronic enclosures. The reticulated foam to fabricate the filters allow for excellent compression (generally 20%-50% of the original thickness) under low compressive forces, while easily recovering from the compressive load without noticeable compression set (permanent deflection).
John Zarganis - Redwood City CA, US Rocky Arnold - San Carlos CA, US John Gabower - Mauston WI, US
Assignee:
WAVEZERO, INC. - Sunnyvale CA
International Classification:
B01D046/00
US Classification:
095285000, 055DIG005, 427244000
Abstract:
The present invention provides electromagnetic interference filters and gaskets. In exemplary embodiments, the filters and gaskets are made from conductively coated reticulated foam having a pore density varying from 10 to 40 pores per inch (PPI). The filters can be used to cover ventilation openings in an electronics enclosure to shield electrical components, equipment and devices from EMI, electrostatic discharge (ESD) and radio frequency interference (RFI) while still providing adequate airflow to enter and cool the system. The filter material may also help prevent dust and dirt from entering the enclosure. The filters of the present invention are also well suited to conductively bridge gaps between mating features of electronic enclosures. The reticulated foam to fabricate the filters allow for excellent compression (generally 20%-50% of the original thickness) under low compressive forces, while easily recovering from the compressive load without noticeable compression set (permanent deflection).
Electromagnetic Interference Shields For Electronic Devices
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.
Electromagnetic Interference Shield For Electronic Devices
An EMI shield for personal computers, cellular telephones, and other electronic devices is constructed from thermoformable polymeric material which is then metallized on all surfaces by vacuum metallization techniques to provide an inexpensive, lightweight, yet effective EMI shield.