John L Geary

US Patent:

7085442, Aug 1, 2006

Filed:

Dec 9, 2003

Appl. No.:

10/731253

Inventors:

Joseph M. Freund - Fogelsville PA, US
John M. Geary - Macungie PA, US

Assignee:

TriQuint Technology Holding Co. - Hillsboro OR

International Classification:

G02B 6/12

US Classification:

385 14

Abstract:

The present invention provides an optoelectronic device, a method of manufacturing thereof, and an optical communications system including the same. The optoelectronic device includes an optical substrate coupled to a submount and including an optical device, and a signal and a ground conductor coupled to the submount, wherein the signal and ground conductors have a direction of signal propagation associated therewith, and wherein related transitions of the signal and ground conductors between the submount and the optical substrate are separated along the direction by a predetermined distance.

US Patent:

20010027986, Oct 11, 2001

Filed:

Jun 15, 1999

Appl. No.:

09/333055

Inventors:

MINDAUGAS FERNAND DAUTARTAS - ALBURTIS PA, US
JOSEPH MICHAEL FREUND - FOGELSVILLE PA, US
WILLIAM ANDREW GAULT - READING PA, US
JOHN MICHAEL GEARY - MACUNGIE PA, US
GEORGE JOHN PRZYBYLEK - DOUGLASVILLE PA, US
DENNIS MARK ROMERO - BETHLEHEM PA, US

International Classification:

B26F003/00

US Classification:

225/001000, 225/093000, 438/460000

Abstract:

A cleaving apparatus, system and method which inhibit damage to cleave edges of laser bars are described. The cleaving apparatus includes a cleaving device having a first and a second slope meeting at a solitary cleave line. The slopes are angled to provide a solitary cleave point at the cleave line. Preferably, the first slope is between zero and four degrees and the second slope is about twenty degrees above a support structure upon which the cleaving device is mounted. A source of air may optionally provide air directed at the cleave line to assist in cleaving the laser bars.

US Patent:

20040066998, Apr 8, 2004

Filed:

Oct 7, 2002

Appl. No.:

10/265834

Inventors:

Joseph Freund - Fogelsville PA, US
John Geary - Macungie PA, US

International Classification:

G02F001/035

US Classification:

385/002000, 385/014000, 385/092000

Abstract:

The present invention is an electronic device including a submount for mounting a component thereon. The submount includes a first high speed transmission line electrically coupled to a contact for providing electrical contact to the component. At least two load resistors are also formed on the submount and electrically coupled to the contact. A second high speed transmission line is coupled between the two resistors to a ground electrode. The impedance and inductance of the second transmission line is desirably such as to provide a loss v. frequency characteristic that is essentially opposite to that of the first transmission line so as to produce a combined characteristic which is essentially flat.

US Patent:

20060006526, Jan 12, 2006

Filed:

Jul 6, 2004

Appl. No.:

10/885271

Inventors:

John Coronati - Allentown PA, US
Gustav Derkits - New Providence NJ, US
David Daugherty - Allentown PA, US
Christopher Fuchs - Exton PA, US
John Geary - Macungie PA, US
David Lischner - Allentown PA, US

International Classification:

H01L 23/34

US Classification:

257720000

Abstract:

The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally, the thermal interposer comprises thin conductors in various configurations that convey electrical signals but significantly limit heat flow.

US Patent:

20070251243, Nov 1, 2007

Filed:

Sep 13, 2004

Appl. No.:

10/939799

Inventors:

John Geary - Macungie PA, US
John Johnson - Schnecksville PA, US
Len Ketelsen - Clinton NJ, US
David Lischner - Allentown PA, US
Thomas Miller - Frisco TX, US

International Classification:

F25B 21/02
G05D 23/30
F25D 23/12

US Classification:

062003700, 062259200, 062202000

Abstract:

Described is a thermally stabilized sensor for cooled component packages. A cooled component package includes a cooled component, a temperature-sensing device located adjacent to the cooled component, and a heat flow modifier located adjacent to the temperature-sensing device. Examples of the heat flow modifier include a ground shield, a wire bonded to platform upon which the cooled component is mounted, and a bonding layer between a refrigerator element and an optical subassembly that includes the cooled component.

US Patent:

62592645, Jul 10, 2001

Filed:

Aug 30, 1999

Appl. No.:

9/385378

Inventors:

Joseph Michael Freund - Fogelsville PA
William Andrew Gault - Mohnton PA
John Michael Geary - Macungie PA

Assignee:

Agere Systems Optoelectronics Guardian Corp. - Orlando FL

International Classification:

G01R 3102

US Classification:

324760

Abstract:

An apparatus and method for performing tests on laser chips that are not labor intensive and will not result in wasted parts should the laser chip fail the test is disclosed. A "bare" laser chip is subjected to a test in accordance with one embodiment by placing the laser chip on an insulating material with an embedded conducting contact through which the current to power the laser chip is passed. A cover plate provides a channel around the laser chip through which a jet of high pressure inert gas is passed to dissipate the self-heating of the laser chip that occurs during the test process. The laser chip is kept in place by physical pressure. In accordance with another embodiment, the temperature of the laser chip is measured and a thermoelectric cooler is used to cool the laser chip. The test on the "bare" laser chip eliminates the need to solder bond the laser chip to a carrier and attach wire bonds to the laser chip, thus reducing associated labor and parts costs.

US Patent:

60749342, Jun 13, 2000

Filed:

Nov 20, 1998

Appl. No.:

9/196956

Inventors:

Mindaugas Fernand Dautartas - Alburtis PA
Joseph Michael Freund - Fogelsville PA
William Andrew Gault - Mohnton PA
John Michael Geary - Macungie PA
George John Przybylek - Douglasville PA
Dennis Mark Romero - Allentown PA

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

H01L 2146

US Classification:

438462

Abstract:

A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets.

Address:

4015 Bayshore Blvd, Tampa, FL 33611

Phone:

(517)9742160

VIN:

WDDGF77X39F323600

Make:

MERCEDES-BENZ

Model:

C-CLASS

Year:

2009