John E Godfrey

US Patent:

20180279515, Sep 27, 2018

Filed:

Mar 24, 2017

Appl. No.:

15/469135

Inventors:

- Redmond WA, US
Whitney Giaimo - Bellevue WA, US
John Godfrey - Woodinville WA, US

International Classification:

H05K 9/00
H05K 1/18
H05K 3/30

Abstract:

The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.

US Patent:

20160273564, Sep 22, 2016

Filed:

Mar 20, 2015

Appl. No.:

14/664391

Inventors:

- Redmond WA, US
Andrew William HILL - Redmond WA, US
Nathan Michael THOME - Seattle WA, US
John GODFREY - Woodinville WA, US
Robyn MCLAUGHLIN - Seattle WA, US
Santosh SHETTY - Redmond WA, US

International Classification:

F16B 5/00
H05K 7/14
H05K 13/00

Abstract:

Examples of the disclosure enable a printed circuit board to be coupled to a chassis. In some examples, a coupling mechanism includes a first body including a head portion and a shaft portion that has an inner surface defining a channel. The coupling mechanism includes a second body including a head portion and a shaft portion. At least a part of the second body shaft portion is positionable within the channel. An outer surface of the second body shaft portion is sized to enable the second body shaft portion to expand radially or move laterally within the channel when the part of the second shaft portion is positioned within the channel. Examples of the disclosure enable the printed circuit board to be coupled to a chassis in low-profile, reduced-stress manner.