Sandeep Jain - Milpitas CA, US David Wyatt - San Jose CA, US Jun Shi - San Jose CA, US Animesh Mishra - Pleasanton CA, US John Halbert - Beaverton OR, US Melik Isbara - Hillsboro OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G11C 5/06 G11C 7/04 G11C 7/00
US Classification:
365212, 365211, 365227, 365 72, 365 63, 365 51
Abstract:
Thermal management and communication is described in the context of memory modules that contain several memory devices. In one example, the invention includes determining a temperature of a first memory device, the first memory device containing a plurality of memory cells, determining a temperature of a second memory device after determining the temperature of the first memory device, the second memory device containing a plurality of memory cells, and generating an alarm based on an evaluation of the first and the second temperatures. In another example, the invention includes detecting a thermal event on a memory device of a memory module that contains a plurality of memory devices, detecting the state of an event bus of the memory module, and sending an alert on the event bus if the event bus is in an unoccupied state.
Method, Apparatus, And System For Active Refresh Management
Sandeep K. Jain - Milpitas CA, US Animesh Mishra - Pleasanton CA, US John B. Halbert - Beaverton OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G11C 7/00
US Classification:
365222, 36523003, 711106
Abstract:
A method, apparatus, and system to enable a partial refresh scheme for DRAM which includes specifying at least a refresh start value, or a refresh start value and a refresh end value, to reduce the number of rows that must be refreshed during a refresh cycle, thus reducing the amount of power consumed during refresh.
Temperature Determination And Communication For Multiple Devices Of A Memory Module
Sandeep Jain - Milpitas CA, US David Wyatt - San Jose CA, US Jun Shi - San Jose CA, US Animesh Mishra - Pleasanton CA, US John Halbert - Beaverton OR, US Melik Isbara - Hillsboro OR, US
The temperature for multiple devices of a memory module are determined. In one example a memory module includes a printed circuit board, a plurality of memory chips on the printed circuit board, each chip containing a plurality of memory cells and a thermal sensor, and a multiplexer on the printed circuit board, independent of the memory chips, coupled to each of the thermal sensors. A current source is coupled to the multiplexer to provide a current to each one of the thermal sensors, and a voltage detector is coupled to the multiplexer to detect a voltage from each of the thermal sensors when a current is applied. A temperature circuit is coupled to the voltage detector to determine a temperature for each memory chip based on the detected voltage.
Method, Apparatus, And System For Active Refresh Management
Sandeep K Jain - Milpitas CA, US Animesh Mishra - Pleasanton CA, US John B Halbert - Beaverton OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G11C 11/406
US Classification:
365222, 711105, 711106, 365149
Abstract:
A method, apparatus, and system to enable a partial refresh scheme for DRAM which includes specifying at least a refresh start value, or a refresh start value and a refresh end value, to reduce the number of rows that must be refreshed during a refresh cycle, thus reducing the amount of power consumed during refresh.
Sandeep Jain - Milpitas CA, US John Halbert - Beaverton OR, US Nilesh Shah - Folsom CA, US
International Classification:
G06F 13/00
US Classification:
711154000
Abstract:
Data is transmitted from a memory device along with a training sequence to deswizzle the data. The training sequence may be sent, for example, when the memory device is initialized, or it may be appended to the data. A memory controller may include logic to receive the data and training sequence and deswizzle the data in response to the training sequence to identify the location of data on various signal lines. Other embodiments are described and claimed.
Sandeep Jain - Milpitas CA, US George Vergis - Hillsboro OR, US John Halbert - Beaverton OR, US Nilesh Shah - Folsom CA, US
International Classification:
G06F 13/38
US Classification:
710062000
Abstract:
Swizzle information for signal lines on a memory component may be stored on the memory component. The swizzle information may be transmitted to a memory controller which may include logic to receive the swizzle information which is then used to deswizzle data received from the memory component. Data may be transmitted from a memory device to a memory controller in a format that is tolerant of swizzling on signal lines between the device and the controller. The format may include codes having unique of numbers of values. Data may be sent in multi-code bursts that divide a data range into progressively smaller ranges. Other embodiments are described and claimed.
Interconnection Of A Packaged Chip To A Die In A Package Utilizing On-Package Input/Output Interfaces
Todd A. Hinck - Arlington MA, US Zuoguo Wu - San Jose CA, US Aaron Martin - El Dorado Hills CA, US Andrew W. Martwick - Portland OR, US John B. Halbert - Beaverton OR, US
International Classification:
H01L 25/065
US Classification:
257738, 257786
Abstract:
Apparatuses for interconnecting integrated circuit dies. A first set of single-ended transmitter circuits are included on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits are included on a second die. The receiver circuits have no termination and no equalization. Conductive lines are coupled between the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched. The first die, the first set of single-ended transmitter circuits, the second die, the first set of single ended receiver circuits and the conductive lines are disposed within a first package. A second set of single-ended transmitter circuits are included on the first die. The transmitter circuits are impedance matched and have no equalization. Data transmitted from the second set of transmitter circuits is transmitted according to a data bus inversion (DBI) scheme. A second set of single-ended receiver circuits is included on a third die. The receiver circuits have termination. Conductive lines are coupled between the second set of transmitter circuits and the second set of receiver circuits. The lengths of the conductive lines are matched and the second set of receiver circuits is disposed within a second package.
Adjusting Interior Lighting Based On Dynamic Glass Tinting
- Milpitas CA, US Erich R. Klawuhn - Los Altos CA, US Brandon Tinianov - Santa Clara CA, US Nitesh Trikha - Pleasanton CA, US John Gordon Halbert Mathew - Santa Rosa CA, US
A method of automatically controlling color of light in a room having one or more tintable windows, the method comprising determining adjustments in artificial interior lighting in the room to obtain a desired color of light and sending control signals over a communication network to adjust the artificial interior lighting, wherein the adjustments are determined based on a current tint state of each of the one or more tintable windows.
Steven Joffre, Gary Kellum, Jennifer Bovell, David Avrahami, Tina Goodin, Sandra Theriault, Dawson Swan, Angus Maitland, Patrick Quinlan, Satyendra Dave, Marilyn Rappaport
John Halbert (1968-1972), Julie Freeman (1966-1970), Ben Friedman (1962-1966), Clinton Bales (1975-1979), Doug Woodward (1967-1971), Jennifer Flower (1978-1982)
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John Halbert
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Work:
Halbert Publishing, LLC - Owner (2010)
Education:
University of Louisiana at Lafayette - General Studies