John E Harper

US Patent:

40416950, Aug 16, 1977

Filed:

Nov 21, 1975

Appl. No.:

5/634219

Inventors:

John Everett Harper - Phoenix AZ
Louis H. Kell - Phoenix AZ

Assignee:

The Garrett Corporation - Los Angeles CA

International Classification:

F02C 722
F02C 912
F02C 726

US Classification:

60 3902

Abstract:

A pneumatic purge system retrofittable upon existing gas turbine engines which includes an accumulator for storing pressurized gas at the maximum pressure developed by the compressor of the turbine engine. Upon actuating a solenoid fuel shutoff valve to initiate engine shutdown, stored gas from the accumulator flows into the fuel manifold to purge fuel therefrom into the combustion chamber. Timing of the pneumatic purging sustains the combustion process to burn substantially all the purged fuel.

US Patent:

20220285288, Sep 8, 2022

Filed:

Mar 4, 2021

Appl. No.:

17/192770

Inventors:

- Santa Clara CA, US
John Harper - Chandler AZ, US
Patrick Nardi - Scottsdale AZ, US
Bamidele Daniel Falola - Chandler AZ, US
Ravi Siddappa - Gilbert AZ, US
James Mertens - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 23/00
H01L 23/06
H05K 7/14

Abstract:

A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100 C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

US Patent:

20210082798, Mar 18, 2021

Filed:

Sep 18, 2019

Appl. No.:

16/575307

Inventors:

- Santa Clara CA, US
Jiongxin LU - Chandler AZ, US
Christopher COMBS - Portland OR, US
Alexander HUETTIS - Aloha OR, US
John HARPER - Chandler AZ, US
Jieping ZHANG - Mesa AZ, US
Nachiket R. RARAVIKAR - Gilbert AZ, US
Pramod MALATKAR - Chandler AZ, US
Steven A. KLEIN - Chandler AZ, US
Carl DEPPISCH - Tempe AZ, US
Mohit SOOD - Chandler AZ, US

International Classification:

H01L 23/498
B23K 3/06
H01L 23/538

Abstract:

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.

US Patent:

20190103345, Apr 4, 2019

Filed:

Sep 29, 2017

Appl. No.:

15/721707

Inventors:

- Santa Clara CA, US
Venkata Suresh R. GUTHIKONDA - Chandler AZ, US
Patrick NARDI - Scottsdale AZ, US
Santosh SANKARASUBRAMANIAN - Chandler AZ, US
Kevin Y. LIN - Chandler AZ, US
Leigh M. TRIBOLET - Chandler AZ, US
John L. HARPER - Chandler AZ, US
Pramod MALATKAR - Chandler AZ, US

International Classification:

H01L 23/498
H01L 23/367
H01L 21/50
H01L 23/52
H01L 23/00
H05K 1/02

Abstract:

An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.