John G Hubert

US Patent:

6498551, Dec 24, 2002

Filed:

Aug 20, 2001

Appl. No.:

09/933128

Inventors:

Danny F. Ammar - Windermere FL
Eugene Fischer - Clermont FL
Gavin Clark - Tavares FL
John Hubert - Clermont FL
Glenn Larson - Winter Garden FL

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01P 100

US Classification:

333247, 333 33, 333 34, 333246, 333260, 257728

Abstract:

A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm microstrip interface line. A base plate is formed of a material that has a higher unmatched coefficient of thermal expansion (CTE) than the carrier board and supports same. A housing is mounted over the carrier board and engages the base plate. The housing has at least one subminiature coaxial connector (SMA) interface mounted thereon. A flexible circuit interconnect, such as a fuzz button, connects the subminiature coaxial connector and MMIC die through the interface line. A thermal interface member is positioned between the carrier board and base plate to aid in heat transfer between the base plate and housing and the lower CTE carrier board.

US Patent:

6594479, Jul 15, 2003

Filed:

Dec 28, 2000

Appl. No.:

09/749425

Inventors:

Danny F. Ammar - Windermere FL
Gavin James Clark - Tavares FL
Eugene Fischer - Clermont FL
John F. Hubert - Windermere FL

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H04B 108

US Classification:

455347, 455 90, 361715, 361818

Abstract:

A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.

US Patent:

6788171, Sep 7, 2004

Filed:

Mar 5, 2002

Appl. No.:

10/091382

Inventors:

Danny F. Ammar - Windermere FL
Eugene Fischer - Clermont FL
Gavin Clark - Tavares FL
John Hubert - Clermont FL
Glenn Larson - Winter Garden FL

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01P 100

US Classification:

333247, 333248, 333204, 333238

Abstract:

A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

US Patent:

7086868, Aug 8, 2006

Filed:

Dec 8, 2004

Appl. No.:

11/007035

Inventors:

John Hubert - Clermont FL, US

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01R 12/00

US Classification:

439 65

Abstract:

The disclosed connector and method transfers high frequency signals from one circuit board to another circuit board, while maintaining good electrical and mechanical performance, at a significantly reduced cost. The connector includes a body member and a conductive pin extending through a center portion of the body member to opposing planar surfaces. An arcuate contact member is positioned within the body member and circumferential to at least a portion of the conductive pin. A flexible conductive material is positioned on an opposing surface and engages the arcuate contact member such that the connector can be positioned between cooperating circuit boards, allowing the conductive pin and arcuate contact member to operatively engage the circuit boards for passing signals therebetween.

US Patent:

7180394, Feb 20, 2007

Filed:

Aug 24, 2004

Appl. No.:

10/924567

Inventors:

Danny F. Ammar - Windermere FL, US
Eugene Fischer - Clermont FL, US
Gavin Clark - Tavares FL, US
John Hubert - Clermont FL, US
Glenn Larson - Winter Garden FL, US

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01P 1/00
H01P 1/20

US Classification:

333247, 333248, 333204, 333238

Abstract:

A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

US Patent:

7248129, Jul 24, 2007

Filed:

May 18, 2005

Appl. No.:

11/132125

Inventors:

John Hubert - Clermont FL, US

Assignee:

Xytrans, Inc. - Orlando FL

International Classification:

H01P 5/00
H01P 5/18

US Classification:

333109, 333112

Abstract:

A microwave directional coupler includes a microstrip conductor formed on a dielectric substrate and forming a main transmission line having in and out ports that receive signals to be coupled. A substantially U-shaped microstrip conductor is formed over the dielectric substrate adjacent to the main transmission line and forms a secondary transmission line having a coupling section and coupler port. A load resistor is formed within the secondary transmission line, and the coupling section is less than a quarter wavelength of a center frequency.