John J Leblanc

US Patent:

6606887, Aug 19, 2003

Filed:

Dec 5, 2001

Appl. No.:

09/683262

Inventors:

David Zimmer - Tampa FL
John LeBlanc - Bradenton FL
Decha Narkmongkon - Seffner FL
Raymond H. Williams - Lutz FL

Assignee:

University of South Florida - Tampa FL

International Classification:

B65D 5514

US Classification:

70164, 70 14, 70 58, 70232, 70 18

Abstract:

An anti-theft equipment locking cover, including a first cover part adapted to overlie a first part of an item of equipment; the first cover part having a flange adapted to underlie a first edge of the item of equipment; a second cover part to overlie a second part of the item of equipment; the second cover part having a flange adapted to underlie a second edge of the item of equipment; the first and second cover parts being disposed in confronting relation to one another so that the item of equipment is fully covered by the confronting first and second cover parts; a tab secured to the first cover part; a slot formed in the second cover part that slideably receives the tab; a distal free end of the tab extending through the slot; an aperture formed in the distal free end of the tab; and a locking device adapted to extend through the aperture to prevent retraction of the tab from the slot.

US Patent:

20040114869, Jun 17, 2004

Filed:

Sep 19, 2003

Appl. No.:

10/666914

Inventors:

Eugene Fike - Amesbury MA, US
John Fijol - Shrewsbury MA, US
Philip Keating - Salem MA, US
Donald Gilbody - Waltham MA, US
John LeBlanc - North Andover MA, US
Stuart Jacobson - Lexington MA, US
Michael Frish - Andover MA, US
Carl Bozler - Waltham MA, US
Craig Keast - Groton MA, US
Michael Fritze - Acton MA, US
Jeffery Knecht - Brookline NH, US

International Classification:

G02B006/26

US Classification:

385/043000, 385/028000

Abstract:

A mode converter including a silicon waveguide core deposited over a first silicon dioxide cladding layer. The silicon waveguide core is formed such that a first end of the silicon waveguide core has a larger cross-sectional area than a second end of the silicon waveguide core. The silicon waveguide core may include a vertical taper and/or a lateral taper.

US Patent:

20100127407, May 27, 2010

Filed:

Nov 25, 2008

Appl. No.:

12/313900

Inventors:

John LeBlanc - North Andover MA, US
Brad Gaynor - Newton MA, US
David Hagerstrom - Amherst NH, US
Caroline Bjune - Andover MA, US

International Classification:

H01L 23/52
H01L 23/48
H01L 21/00
H01L 23/482
H01L 23/495
H01L 23/522
H01L 21/70

US Classification:

257777, 257786, 438109, 438118, 257E25029, 257E23011, 257E23012, 257E23052, 257E23142, 257E21532

Abstract:

A two-sided substrateless multichip module including at least one die layer having at least one die. At least one bottomside interconnect layer is coupled to a bottom surface of the at least one die. At least one topside interconnect layer is coupled to a top surface of the at least one die. One or more embedded electrical connections is configured to provide an electrical interconnection between the at least one bottomside interconnect layer and the at least one die and/or the at least bottomside interconnect layer and the at least one topside interconnect layer and/or the at least one topside interconnect layer and the at least one die, wherein the at least one bottomside interconnect layer includes one or more electrical contacts on a bottom surface of the multichip module and the at least topside interconnect layer includes one or more electrical contacts on a top surface of the multichip module.