John E Macpherson

US Patent:

6348742, Feb 19, 2002

Filed:

Jan 25, 1999

Appl. No.:

09/236523

Inventors:

John MacPherson - Fremont CA

Assignee:

Clear Logic, Inc. - San Jose CA

International Classification:

H01L 2348

US Classification:

257786, 257784, 257659, 257503, 257783, 257787, 257692, 257 48, 257480, 257773, 324754, 324765, 3241581, 324 54, 324762, 324758

Abstract:

A bond pad structure is provided which has a primary bond pad region electrically connected to a secondary bond pad region. The secondary bond pad region is used to test a circuit for configuration, while the primary bond pad is covered with a protective oxide. After configuration and etching to complete desired disconnections, the oxide is removed from the primary bond pad region, leaving an undamaged surface for subsequent wire bonding. The primary bond pad region and the secondary bond pad region can be a unitary structure or two separate structures.

US Patent:

6369437, Apr 9, 2002

Filed:

Jan 12, 1999

Appl. No.:

09/229040

Inventors:

John MacPherson - Fremont CA
Alan H. Huggins - Gilroy CA
Richard J. Schmidley - San Jose CA

Assignee:

Clear Logic, Inc. - San Jose CA

International Classification:

H01L 2900

US Classification:

257529, 257665, 257209

Abstract:

A vertical fuse structure and methods for customization of integrated circuits include a substantially vertically-oriented interconnect structure or âfuseâ which provides for a more densely packed and thus smaller programmable integrated circuit. In a preferred embodiment, a vertical interconnect structure is fabricated by forming a first interconnect layer, forming an insulating layer over the first interconnect layer in which substantially vertically-oriented vias are patterned in contact with the first interconnect layer, filling the vias with a conductive plug, and forming a second interconnect layer over the insulating layer in contact with the conductive plug. The vertical interconnect structure is preferably disconnected by forming a narrow, substantially vertical disconnect cavity through the second interconnect layer and a portion of the conductive plug, thereby removing the connection between the second interconnect layer and the plug.

US Patent:

6486527, Nov 26, 2002

Filed:

Jun 25, 1999

Appl. No.:

09/344613

Inventors:

John MacPherson - Fremont CA 94538
Jayaraman Iyer - San Jose CA 95136
Alan H. Huggins - Gilroy CA 95020
John S. Starzynski - Salinas CA 93906
Keith R. Erb - Watsonville CA 95076

International Classification:

H01L 2900

US Classification:

257529, 257530, 257758

Abstract:

According to the present invention, after manufacture of a disconnect fuse circuit, windows are opened in the insulating film overlying the second interconnect layer at all possible disconnection points, the disconnection points preferably being an exposure window that is aligned over a disconnect fuse circuit that includes a via that electrically connects electrical conductors disposed on different respective layers. This insulating film may consist of one or more layers of one or more materials, but preferentially consists of a single layer of silicon oxide. The wafer is then stored for later configuration. When the wafer is to be configured, a non-precision mask is manufactured. The wafer is coated with photoresist and patterned using the mask to produce disconnection holes in the photoresist at the desired disconnection points. Since the area over the desired disconnection points are free of the insulating film overlying the second patterned interconnect layer, the etching process can be limited to etch techniques which are optimized to etch metal with selectivity to the insulating film. The areas at the disconnection sites that are covered by the insulating film are further protected during the etch process, since the insulating film acts as an etch barrier to inhibit the etching of active circuit elements in proximity to the desired disconnect points.

US Patent:

6749748, Jun 15, 2004

Filed:

Dec 28, 2001

Appl. No.:

10/033695

Inventors:

John Wallace Macpherson - Snohomish WA
Jason Jacob Ziemer - Buckley WA
Everett J. Nichols - Edmonds WA

Assignee:

Vanson Halosource, Inc. - Redmond WA

International Classification:

C02F 156

US Classification:

2101981, 210199, 210206, 252176, 422276

Abstract:

In one aspect the present invention provides purification devices for reducing the amount of contaminants in water, each device includes a water-soluble flocculant disposed within a body defining a multiplicity of pores, wherein the pores have an average diameter in the range of from 1 m to 2000 m. The present invention also provides methods for reducing the amount of contaminants in water.

US Patent:

6821427, Nov 23, 2004

Filed:

Apr 20, 2004

Appl. No.:

10/827812

Inventors:

John Wallace Macpherson - Snohomish WA
Jason Jacob Ziemer - Buckley WA
Everett J. Nichols - Edmonds WA

Assignee:

Vanson Halosource, Inc. - Redmond WA

International Classification:

C02F 156

US Classification:

210631, 210602, 210727, 210728, 210730, 210731, 210734, 252176, 252180

Abstract:

In one aspect the present invention provides purification devices for reducing the amount of contaminants in water, each device includes a water-soluble flocculant disposed within a body defining a multiplicity of pores, wherein the pores have an average diameter in the range of from 1 m to 2000 m. The present invention also provides methods for reducing the amount of contaminants in water.

US Patent:

8510057, Aug 13, 2013

Filed:

May 8, 2008

Appl. No.:

12/151977

Inventors:

Linda Avey - Los Gatos CA, US
Andro Rene Hsu - Berkeley CA, US
Oleksiy Khomenko - Stanford CA, US
John Michael Macpherson - Palo Alto CA, US
Joanna Louise Mountain - Menlo Park CA, US
Brian Thomas Naughton - Mountain View CA, US
Serge Saxonov - Seattle WA, US
Anne Wojcicki - Palo Alto CA, US
Alexander Wong - Palo Alto CA, US

Assignee:

23andMe, Inc. - Mountain View CA

International Classification:

G06F 7/00

US Classification:

702 19, 702 20, 703 11, 707700, 436501

Abstract:

Summarizing an aggregate contribution to a characteristic for an individual is disclosed, including determining the characteristic to be evaluated, identifying one or more markers associated with the characteristic, retrieving the measurement of the individual for each of the one or more markers from a database of individuals' markers, retrieving a statistical factor that measures the association between the marker associated with the characteristic and the characteristic for each of the one or more markers from the marker database, and determining the aggregate contribution based at least in part on the retrieved statistical factors.

US Patent:

8543339, Sep 24, 2013

Filed:

Dec 4, 2009

Appl. No.:

12/592950

Inventors:

Anne Wojcicki - Palo Alto CA, US
Linda Avey - Lafayette CA, US
Joanna Louise Mountain - Menlo Park CA, US
John Michael Macpherson - Palo Alto CA, US
Joyce Yeh-hong Tung - Menlo Park CA, US

Assignee:

23andMe, Inc. - Mountain View CA

International Classification:

G06F 7/00

US Classification:

702 19, 702 20, 703 13, 707700

Abstract:

Gamete donor selection includes receiving a specification including a phenotype of interest, receiving a genotype of a recipient and a plurality of genotypes of a respective plurality of donors, determining statistical information pertaining to the phenotype of interest based at least in part on different pairings of the genotype of the recipient and a genotype of a donor in the plurality of donors, and identifying a preferred donor among the plurality of donors, based at least in part on the statistical information determined.

US Patent:

20010000210, Apr 12, 2001

Filed:

Dec 6, 2000

Appl. No.:

09/732218

Inventors:

John MacPherson - Fremont CA, US
Wendy Eng - San Jose CA, US

International Classification:

H01L023/495
H01L021/44
H01L021/48
H01L021/50

US Classification:

257/666000, 438/125000

Abstract:

A structure and method are provided to allow a die to be packaged more uniformly and in parallel with a package by utilizing a lead frame having at least one cavity within the lead frame, thereby allowing excess die-attach epoxy can flow into the cavity or cavities and reducing the amount of contact surface area between the die and lead frame.