John Edward Mckinley

US Patent:

53594886, Oct 25, 1994

Filed:

Jun 21, 1993

Appl. No.:

8/079767

Inventors:

Kevin A. Leahy - Eldersburg MD
Andrew J. Piloto - Columbia MD
John G. McKinley - Ellicott City MD
David B. Harris - Columbia MD
Timothy M. Fertig - Pasadena MD
Keith W. Sparks - Columbia MD

Assignee:

Westinghouse Electric Corporation - Pittsburgh PA

International Classification:

H05K 720

US Classification:

361707

Abstract:

A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.