Methods of forming mask patterns and methods of forming field emitter tip masks are described. In one embodiment a first surface is provided over which a mask pattern is to be formed. A mixture comprising mask particles is applied to a second surface comprising material joined with the first layer. The mixture, as applied, leaves an undesirable distribution of mask particles over the first surface. After application of the mixture to the second surface, the mask particles are laterally distributed over the first surface, into a desirable distribution by placing a particle-dispersing structure directly into the mixture on the second surface and moving the particle-dispersing structure laterally through the mixture on the second surface. In another embodiment, a mixture is formed on the substrates second surface and includes a liquid component and a plurality of solid mask-forming components. A mixture-thinning structure is positioned over the substrate and separated from the second surface thereof only by the mixture.
Uphill Screen Printing In The Manufacturing Of Microelectronic Components
John M. Michiels - Boise ID Darryl M. Stansbury - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
B41M 112
US Classification:
101129, 101123
Abstract:
Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous âuphillâ manner. The disclosed method is particularly suitable for forming continuous electrically conductive structures or circuit traces extending from a lower level of a substrate, such as an anode plate of an FED device, up onto at least one second surface vertically distanced from the substrate. The electrically conductive structure may optionally terminate into a specifically configured contact pad for accommodating complimentary contacting structures located on a mating component, such as a cathode plate of an FED device.
Structures, Lithographic Mask Forming Solutions, Mask Forming Methods, Field Emission Display Emitter Mask Forming Methods, And Methods Of Forming Plural Field Emission Display Emitters
John Michiels - Boise ID David Wells - Boise ID Eric J. Knappenberger - Meridian ID James J. Alwan - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G03C 500
US Classification:
430313, 430311, 430323
Abstract:
The present invention includes structures, lithographic mask forming solutions, mask forming methods, field emission display emitter mask forming methods, and methods of forming plural field emission display emitters. One aspect of the present invention provides a mask forming method including forming a masking layer over a surface of a substrate; screen printing plural masking particles over a surface of the masking layer; and removing at least portions of the masking layer using the masking particles as a mask. Another aspect of the present invention provides a method of forming plural field emission display emitters. This method includes forming a masking layer over an emitter substrate; screen printing a plurality of masking particles over the masking layer; removing portions of the masking layer intermediate the screen printed masking particles to form a plurality of masking elements; removing the masking particles from the masking elements; and removing portions of the emitter substrate to form plural emitters.
Structures, Lithographic Mask Forming Solutions, Mask Forming Methods, Field Emission Display Emitter Mask Forming Methods, And Methods Of Forming Plural Field Emission Display Emitters
John Michiels - Boise ID David Wells - Boise ID Eric J. Knappenberger - Meridian ID James J. Alwan - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G03C 176
US Classification:
4302701, 430 5, 430949
Abstract:
The present invention includes structures, lithographic mask forming solutions, mask forming methods, field emission display emitter mask forming methods, and methods of forming plural field emission display emitters. One aspect of the present invention provides a mask forming method including forming a masking layer over a surface of a substrate; screen printing plural masking particles over a surface of the masking layer; and removing at least portions of the masking layer using the masking particles as a mask. Another aspect of the present invention provides a method of forming plural field emission display emitters. This method includes forming a masking layer over an emitter substrate; screen printing a plurality of masking particles over the masking layer; removing portions of the masking layer intermediate the screen printed masking particles to form a plurality of masking elements; removing the masking particles from the masking elements; and removing portions of the emitter substrate to form plural emitters.
John Michiels - Boise ID David Wells - Boise ID Eric J. Knappenberger - Meridian ID James J. Alwan - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G03C 500
US Classification:
4302701, 430 5, 430308, 430313, 430322, 430330
Abstract:
The present invention includes structures, lithographic mask forming solutions, mask forming methods, field emission display emitter mask forming methods, and methods of forming plural field emission display emitters. One aspect of the present invention provides a mask forming method including forming a masking layer over a surface of a substrate; screen printing plural masking particles over a surface of the masking layer; and removing at least portions of the masking layer using the masking particles as a mask. Another aspect of the present invention provides a method of forming plural field emission display emitters. This method includes forming a masking layer over an emitter substrate; screen printing a plurality of masking particles over the masking layer; removing portions of the masking layer intermediate the screen printed masking particles to form a plurality of masking elements; removing the masking particles from the masking elements; and removing portions of the emitter substrate to form plural emitters.
Mask Forming Methods And A Field Emission Display Emitter Mask Forming Method
John Michiels - Boise ID David Wells - Boise ID Eric J. Knappenberger - Meridian ID James J. Alwan - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G03F 900
US Classification:
430 5, 430323, 430313, 430949
Abstract:
The present invention includes structures, lithographic mask forming solutions, mask forming methods, field emission display emitter mask forming methods, and methods of forming plural field emission display emitters. One aspect of the present invention provides a mask forming method including forming a masking layer over a surface of a substrate; screen printing plural masking particles over a surface of the masking layer; and removing at least portions of the masking layer using the masking particles as a mask. Another aspect of the present invention provides a method of forming plural field emission display emitters. This method includes forming a masking layer over an emitter substrate; screen printing a plurality of masking particles over the masking layer; removing portions of the masking layer intermediate the screen printed masking particles to form a plurality of masking elements; removing the masking particles from the masking elements; and removing portions of the emitter substrate to form plural emitters.
Semiconductive Substrate Processing Methods And Methods Of Processing A Semiconductive Substrate
John Michiels - Boise ID David Wells - Boise ID Eric J. Knappenberger - Meridian ID James J. Alwan - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G03C 500
US Classification:
430313, 430 5, 430311, 430323
Abstract:
The present invention includes structures, lithographic mask forming solutions, mask forming methods, field emission display emitter mask forming methods, and methods of forming plural field emission display emitters. One aspect of the present invention provides a mask forming method including forming a masking layer over a surface of a substrate; screen printing plural masking particles over a surface of the masking layer; and removing at least portions of the masking layer using the masking particles as a mask. Another aspect of the present invention provides a method of forming plural field emission display emitters. This method includes forming a masking layer over an emitter substrate; screen printing a plurality of masking particles over the masking layer; removing portions of the masking layer intermediate the screen printed masking particles to form a plurality of masking elements; removing the masking particles from the masking elements; and removing portions of the emitter substrate to form plural emitters.
Uphill Screen Printing In The Manufacturing Of Microelectronic Components
John M. Michiels - Boise ID Darryl M. Stansbury - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
B41M 112
US Classification:
101129, 101123
Abstract:
Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous âuphillâ manner. The disclosed method is particularly suitable for forming continuous electrically conductive structures or circuit traces extending from a lower level of a substrate, such as an anode plate of an FED device, up onto at least one second surface vertically distanced from the substrate. The electrically conductive structure may optionally terminate into a specifically configured contact pad for accommodating complementary contacting structures located on a mating component, such as a cathode plate of an FED device.