John D Ransom

US Patent:

7683494, Mar 23, 2010

Filed:

Jun 18, 2008

Appl. No.:

12/214479

Inventors:

Thomas Stortini - Fremont CA, US
John A. Ransom - Nampa ID, US

Assignee:

ZiLOG, Inc. - San Jose CA

International Classification:

H01L 23/52
H01L 23/48
H01L 29/40
H01L 23/495
H01L 23/485
H01L 23/498

US Classification:

257785, 257737, 257E23021, 257E23069, 257668

Abstract:

An insulative substrate includes a plurality of flexible retaining clips and a plurality of alignment and retaining pins. A metal leadframe includes a plurality of leads. Each lead terminates in a spring contact beam portion. The leadframe is attached to the substrate (for example, by fitting a hole in each lead over a corresponding alignment and retaining pin and then thermally deforming the pin to hold the lead in place). An integrated circuit is press-fit down through the retaining clips such that pads on the face side of the integrated circuit contact and compress the spring contact beams of the leads. After the press-fit step, the retaining clips hold the integrated circuit in place. The resulting assembly is encapsulated. In a cutting and bending step, the leads are singulated and formed to have a desired shape. The resulting low-cost package involves no wire-bonding and no flip-chip bond bump forming steps.

US Patent:

7884489, Feb 8, 2011

Filed:

Jan 12, 2010

Appl. No.:

12/657094

Inventors:

Thomas Stortini - Fremont CA, US
John A. Ransom - Nampa ID, US

Assignee:

IXYS CH GmbH

International Classification:

H01L 23/52
H01L 23/48
H01L 29/40
H01L 23/495
H01L 23/485
H01L 23/498

US Classification:

257785, 257737, 257668, 257E23021, 257E23069

Abstract:

An insulative substrate includes a plurality of flexible retaining clips and a plurality of alignment and retaining pins. A metal leadframe includes a plurality of leads. Each lead terminates in a spring contact beam portion. The leadframe is attached to the substrate (for example, by fitting a hole in each lead over a corresponding alignment and retaining pin and then thermally deforming the pin to hold the lead in place). An integrated circuit is press-fit down through the retaining clips such that pads on the face side of the integrated circuit contact and compress the spring contact beams of the leads. After the press-fit step, the retaining clips hold the integrated circuit in place. The resulting assembly is encapsulated. In a cutting and bending step, the leads are singulated and formed to have a desired shape. The resulting low-cost package involves no wire-bonding and no flip-chip bond bump forming steps.