John W Roman

US Patent:

8153474, Apr 10, 2012

Filed:

Oct 13, 2010

Appl. No.:

12/903761

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX

International Classification:

H01L 21/52

US Classification:

438107, 438108, 438118, 438128, 257E215

Abstract:

A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.

US Patent:

8283769, Oct 9, 2012

Filed:

Oct 13, 2010

Appl. No.:

12/903734

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX

International Classification:

H01L 21/00

US Classification:

257690, 257692, 257718, 257E21705, 257E23194, 257E23185, 257E23193, 257E33059

Abstract:

A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.

US Patent:

8560104, Oct 15, 2013

Filed:

Oct 13, 2010

Appl. No.:

12/903772

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX
RJR Polymers, Inc. - Oakland CA

International Classification:

G06F 19/00

US Classification:

700 98

Abstract:

A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing assembly process.

US Patent:

8639373, Jan 28, 2014

Filed:

Oct 13, 2010

Appl. No.:

12/903779

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX
RJR Polymers, Inc. - Oakland CA

International Classification:

G06F 19/00

US Classification:

700 98

Abstract:

A method of designing a desired modular package assembly: determining the configuration and dimensions of the assembly from received user input design data, the assembly having a protective modular package cover with first and second fastening sections, subassembly receiving sections disposed between the fastening sections and having a cross member formed along the underside of the protective modular package cover and configured to receive a subassembly, and one or more subassemblies to be received by the subassembly receiving sections; determining an adhesive deposition strategy for deposition of an adhesive layer to the cross members of the subassembly receiving sections sufficient to affix the top side of the subassemblies to the cross members on the underside of the subassembly receiving sections; and incorporating the configuration and dimensions of the modular package assembly and the adhesive deposition strategy into a manufacturing assembly process configured to manufacture the modular package assembly.

US Patent:

20110084376, Apr 14, 2011

Filed:

Oct 13, 2010

Appl. No.:

12/903752

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMICROELECTRONICS, INC. - Carollton TX
RJR POLYMERS, INC. - Oakland CA

International Classification:

H01L 23/495
H01L 23/32

US Classification:

257690, 257685, 257E23194

Abstract:

A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element; a protective modular package cover having fastening sections located at opposing ends of the cover, torque elements disposed on the opposing ends and configured to fasten the cover to a core, and subassembly receiving sections disposed between the fastening sections with each subassembly receiving section operable to receive a subassembly and having a cross member along the underside of the cover; and an adhesive layer configured to affix subassemblies to respective subassembly receiving sections. The torque elements are configured to transfer a downward clamping force generated at the fastening elements to a top surface of the subassemblies via the cross member of each of the one or more subassembly receiving sections.