John K Summers

US Patent:

6469126, Oct 22, 2002

Filed:

Dec 21, 2000

Appl. No.:

09/741943

Inventors:

Brian C. Auman - Pickerington OH
John D. Summers - Chapel Hill NC

Assignee:

E. I. du Pont de Nmeours and Company - Wilmington DE

International Classification:

C08G 7310

US Classification:

528170, 528125, 528128, 528172, 528173, 528176, 528183, 528188, 528220, 528229, 528350, 528353

Abstract:

Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

US Patent:

6476177, Nov 5, 2002

Filed:

Dec 21, 2000

Appl. No.:

09/742860

Inventors:

Brian C. Auman - Pickerington OH
John R Dodd - Wilmington DE
Mark A Guidry - New Castle DE
John D. Summers - Chapel Hill NC

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

C08G 7310

US Classification:

528170, 528125, 528128, 528172, 528173, 528176, 528183, 528188, 528220, 528229, 528350, 528353

Abstract:

Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

US Patent:

6476182, Nov 5, 2002

Filed:

Dec 21, 2000

Appl. No.:

09/741942

Inventors:

Brian C Auman - Pickerington OH
John D Summers - Chapel Hill NC

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

C08G 7310

US Classification:

528353, 528125, 528128, 528170, 528172, 528173, 528176, 528183, 528188, 528220, 528229, 528350

Abstract:

Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

US Patent:

6908685, Jun 21, 2005

Filed:

Aug 23, 2001

Appl. No.:

10/343277

Inventors:

Kenji Uhara - Nagoya, JP
Kouichi Sawasaki - Nagoya, JP
Naofumi Yasuda - Tokai, JP
Brian C. Auman - Pickerington OH, US
John D. Summers - Chapel Hill NC, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE
DuPont-Toray Co. Ltd. - Tokyo

International Classification:

C08G073/10
B32B027/08
B32B015/08
C08L077/00

US Classification:

4284735, 428209, 428457, 428901, 528125, 528126, 528128, 528170, 528172, 528173, 528179, 528183, 528188, 528220, 528229, 528350, 528351, 528353, 525420, 525432, 525436, 264165, 264175, 2641761, 264212, 264299, 264319

Abstract:

The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.