John Hsin Tseng

US Patent:

20130163918, Jun 27, 2013

Filed:

Dec 27, 2012

Appl. No.:

13/728966

Inventors:

John Tseng - Cupertino CA, US
Luis Martinez - Livermore CA, US
Anthony J. Ticknor - Cupertino CA, US

Assignee:

NEOPHOTONICS CORPORATION - San Jose CA

International Classification:

G02B 6/26
G02B 6/42
G02B 6/136
G02B 6/34

US Classification:

385 14, 438 31

Abstract:

A method of manufacture of an integrated circuit coupling system includes: forming a waveguide assembly, having a top clad over an open end of an optical core; forming a first photoresist having a base photoresist pattern shape with sloped photoresist sidewalls tapered down to expose a portion of the top clad; forming a recess having clad sidewalls from the portion of the top clad exposed by the base photoresist pattern shape, the clad sidewalls having a shape replicating a shape of the base photo resist pattern shape; and forming an optical vertical insertion area, from the clad sidewalls forming the recess, having a pocket trench, a horizontal step, and a mirror with a reflective material selectively applied to a section of the clad sidewalls and exposing the open end opposite to the mirror, the horizontal step between the mirror and the pocket trench.

US Patent:

20160020158, Jan 21, 2016

Filed:

Jul 21, 2014

Appl. No.:

14/337158

Inventors:

- San Jose CA, US
John Tseng - Redwood City CA, US
Parag Madhani - Allentown, PA

Assignee:

LSI Corporation - San Jose CA

International Classification:

H01L 21/66
G06F 17/50
H01L 23/31
H01L 21/56
H01L 23/00

Abstract:

The present inventions are related to systems and methods for circuit implementation, and more particularly to systems and methods for securing data in a circuit.